SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • IPC International Conference Offers Answers to Chalenges of Flexible Circuits.

IPC International Conference Offers Answers to Chalenges of Flexible Circuits.

Mar 27, 2010

BANNOCKBURN, Ill, USA, - One of the fastest growing segments of the PCB market worldwide, flexible circuits provide new opportunities in the areas of creative design, miniaturization, circuit density and interconnection reliability to help boost a company’s bottom line. In fact, many of today’s advanced applications can only take place using flexible circuitry, so learning how to utilize special materials and fabrication processes is key. To provide timely information on the application of sound scientific and engineering practice of flexible circuits, the IPC International Conference on Flexible Circuits will be held June 15–16, 2010, in Irvine, Calif., with half-day workshops on June 15 and a full-day of technical conference sessions on June 16.

On the morning of Tuesday, June 15, Michael Carano, vice president, OMG Electrical Chemicals, will deliver a workshop focusing on critical process parameters required for the proper desmear, metallization and electrodeposition of flexible and rigid-flexible substrates. The afternoon workshop led by Brent Sweitzer, senior R &D engineer, Multek Flexible Circuits, Inc., will address the factors inherent in the determination of appropriate materials and test strategy.

The technical conference on June 16 will kick off as Al Wasserzug, director of business development, Vulcan Flex Circuit Corporation, and Jay Desai, director of marketing for MFlex, reveal the growing business opportunities that exist for flex manufacturers. Robert Burns, national sales and marketing director, Printed Circuits, Inc., will discuss the current use of embedded passives in flex circuits. Happy Holden, chief technical officer, Foxconn, and Robert Sheldon, applications engineering manager, Pioneer Circuits, Inc. will lead a panel discussion and debate on impedance in a flex application.

Mar 18, 2024 -

Foreign Object Debris for Electronics Manufacturing Course Available in Spanish, French and German

Mar 11, 2024 -

FTG Circuits Earns IPC-1791 Trusted Electronic Designer, Fabricator and Assembler QML Requalification

Mar 11, 2024 -

Best Technical Conference Papers at IPC APEX EXPO 2024 Selected

Mar 11, 2024 -

Top of the Class: IPC APEX EXPO Named One of Trade Show Executive's Fastest 50, Class of 2023

Mar 04, 2024 -

Electronics Industry Praises U.S. Government Notice of Funding Opportunity for "Advanced Packaging" Technologies

Mar 04, 2024 -

Registration Open for Electrical Wire Processing Technology Expo (EWPTE) 2024

Feb 26, 2024 -

IPC White Paper Emphasizes the Critical Importance of Data Analytics for the Electronics Manufacturing Process

Feb 26, 2024 -

North American PCB Industry Sales Down 3.9 Percent in January

Feb 26, 2024 -

North American EMS Industry Up 2.6 Percent in January

Feb 19, 2024 -

Honeywell Aerospace Engineer Christina Rutherford to Deliver Keynote at Electrical Wire Processing Technology Expo (EWPTE)

1461 more news from Association Connecting Electronics Industries (IPC) »

Mar 19, 2024 -

Made in Japan: Solder Paste Jet Dispensing Machine

Mar 18, 2024 -

Kurtz Ersa Inc. Receives 2024 CIRCUITS ASSEMBLY NPI Award for the VERSAFLOW ONE X-Series

Mar 18, 2024 -

MicroCare, LLC Named a Best Place to Work in Connecticut for 2024

Mar 18, 2024 -

Solderstar to Showcase Advanced Solutions at EPP Innovations FORUM 2024

Mar 18, 2024 -

Solderstar to Showcase Advanced Solutions at EPP Innovations FORUM 2024

Mar 18, 2024 -

Solderstar to Showcase Advanced Solutions at EPP Innovations FORUM 2024

Mar 18, 2024 -

SHENMAO Low-Temperature Solder Paste PF735-PQ10-10 Is Designed for High-Speed Printing Processes

Mar 18, 2024 -

Ultrasonic Selective Fluxing System Excels in Efficiency

Mar 18, 2024 -

Silicon Mountain Accelerates Electronics Manufacturing with Universal Instruments Fuzion System Acquisition

Mar 18, 2024 -

BTU's Aurora Scores Another Award – 2024 NPI Award Recipient

See electronics manufacturing industry news »

IPC International Conference Offers Answers to Chalenges of Flexible Circuits. news release has been viewed 648 times

  • SMTnet
  • »
  • Industry News
  • »
  • IPC International Conference Offers Answers to Chalenges of Flexible Circuits.
Encapsulation Dispensing, Dam and Fill, Glob Top, CSOB

See Your 2024 IPC Certification Training Schedule for Eptac