SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Essemtec's Compact Desk Reflow and Curing Oven Offers Lead-Free Soldering Capability

Essemtec's Compact Desk Reflow and Curing Oven Offers Lead-Free Soldering Capability

Dec 03, 2008

The RO06-PLUS batch oven from Essemtec offers lead-free soldering capability as well as curing programs with durations up to 18 hours. The oven features a small footprint, integrated microprocessor control and fully automatic processing. Its main applications include prototyping, small batch manufacturing and testing.

RO06-PLUS is easy to operate. The integrated microprocessor control provides a large set of predefined soldering and curing programs to make it simple for beginners. For experienced users the control includes enough free memory for their own temperature profiles. Temperatures up to 300�C and process times up to 18 hours can be stored.

The large view window allows the process to be observed. This feature, in combination with the unique process pausing function, is mainly used in the areas of material testing or process evaluation. If a new soldering profile or materials have to be evaluated, the soldering process can be extended manually until the desired result can be observed through the window.

For process documentation, the oven can measure temperatures directly on the processed materials by thermocouples. Zone and material temperatures are shown on the integrated LCD or can be transmitted via an RS232 interface to external plotting and recording software such as RO-SOFT.

The RO06-PLUS consists of two process zones, a sealed heat chamber and an open cooling section. A motorized drawer drives the substrates between the two zones, which offer fully automatic processing. The oven features an integrated microprocessor control that ensures soldering or curing temperatures and times are met according to the program.

The RO06-PLUS reflow oven meets the process requirements for lead-free soldering. The hot process chamber includes a full convection heating system for even temperature distribution with smallest Delta-T values and the quartz lamp support enables steep ramping. The processing capabilities, the automated process flow and the feasibility of storing various profiles have made RO06-PLUS the preferred solution in the lab and in low-volume manufacturing all over the world.

With this system, users also have access to Essemtec's remote maintenance system and to the MyEssemtec.com user portal on the Internet. Additionally, Essemtec's Flex2-Services program offers attractive solutions for financing and service.

Since 1991, Essemtec USA has been a leader in the branch of flexible production systems for the industry. Essemtec develops, fabricates, and distributes equipment and machines for all processes of electronic manufacturing: printer, dispenser, pick-and-place and solder systems. All machines are made in Switzerland, which represents the world's highest quality and reliability.

Manual, semiautomatic and fully automatic systems are available. Transportation and storing systems also belong to the range of products as well as software solutions for the planning, simulation, optimization and documentation of the fabrication. All Essemtec systems are optimized on maximum flexibility. The user can adapt from one product to the next as quickly as possible while taking of optimal production capacity.

Sep 16, 2024 -

Essemtec Wins 2024 Mexico Technology Award for Excellence in Dispensing Technology

Aug 26, 2024 -

Essemtec Presents All-in-One SMT Solutions of High-Speed Dispensing, Pick-and-Place and Integrated Inspection Systems at SMTA Guadalajara

Jun 10, 2024 -

Essemtec is exhibiting at SMTconnect booth 4.209.

May 20, 2024 -

SMTO ENTERS NEW PARTNERSHIP WITH ESSEMTEC FOR MEXICO

Mar 18, 2024 -

Essemtec is exhibiting at APEX Expo at booth 2409.

Mar 11, 2024 -

Explore Essemtec's Naturally Adaptive Manufacturing Solutions at the SMTA Monterrey Expo

Nov 05, 2021 -

Essemtec Won the 2021 Mexico Technology Innovation Award for Its Solder Paste Jet Dispensing Solution

Nov 05, 2021 -

Nano Dimension Acquires Essemtec AG, Surface-Mount Pick & Place Systems Supplier for the PCB and OEM Industries

Oct 13, 2021 -

Essemtec Will Demo New Multi-Function Solder Paste Jetting Solution at Productronica 2021

Oct 07, 2021 -

Essemtec to Show the Latest Innovation for Solder Jet Printing at SMTAI

215 more news from ESSEMTEC AG »

Sep 20, 2024 -

VIBRO METER VM600 MPC4 200-510-070-113

Sep 20, 2024 -

Triconex CM3201 Digital input unit control card Module

Sep 20, 2024 -

WOODWARD 9907-186 Load Sharing Module

Sep 20, 2024 -

Triconex 3603T Digital Output

Sep 20, 2024 -

BENTLY NEVAD 330101-00-16-10-02-00

Sep 20, 2024 -

EPRO PR9268/201-000

Sep 20, 2024 -

ABB SPDSI13 Analog input module

Sep 20, 2024 -

HONEYWELL MU-TSIM12 51303932-426

Sep 20, 2024 -

Schneider 140CRA21220

Sep 20, 2024 -

PFEIFFER D-35614

See electronics manufacturing industry news »

Essemtec's Compact Desk Reflow and Curing Oven Offers Lead-Free Soldering Capability news release has been viewed 911 times

  • SMTnet
  • »
  • Industry News
  • »
  • Essemtec's Compact Desk Reflow and Curing Oven Offers Lead-Free Soldering Capability
Win Source Online Electronic parts

Reflow Oven