Glenbrook Technologies Inc., a leading supplier of Real-time X-ray Inspection Systems to the electronic fabrication and semiconductor assembly industries has announced the availability of a newly developed X-ray inspection system, MICROTECH RTX113.
The MICROTECH model is designed for ultra-high resolution X-ray inspection requirements such as laser drilling of multi-layer PCBs and populated PCBs containing BGAs, uBGAs and Chip Scale Packages (CSPs). The high-powered system contains a 10 micron focal spot for inspecting 3 mil laser drilled holes.
The MICROTECH RTX-113's X-ray tube permits magnification between 4X and 225X. An optional Video Measurement System can be easily integrated to enable users to accurately measure XY offset and hole-to-pad misalighnment.
Glenbrook Technologies Inc.'s proprietary X-ray inspection systems are used by electronics manufacturers and assemblers worldwide, in both laboratory and production settings to verify the integrity of hidden solder joints in ball-grid array packages (BGA's), as well as, other sophisticated electronic packaging technologies. A patent was awarded to Glenbrook for its unique X-ray camera design and it's revolutionary RTX-Dual-VU system, which displays simultaneous and congruent real-time X-ray and visual images.