Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, today announced plans to introduce the new KYOWA ELECTRONIC INSTRUMENTS CO., LTD. PCAS-1000A Stress Measurement Kit. Company representatives will show the kit for the first time in Booth #2043 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca.
The PCAS-1000A Stress Measurement Kit is designed for efficient quality control and quality assurance for PCBs. It comes with a special software package for measurement in accordance with IPC/JEDEC-9704A and a sensor interface that enables even a beginner of strain measurement to easily measure stress on PCBs.
The PCAS-100A Printed Circuit Assembly Stress Measuring Software is the most suitable software for testing PCBs variously in accordance with IPC/JEDEC-9704A. It enables seamless instrument setting, data acquisition and report preparation.
For more information about the system or Seika’s complete product line, contact Michelle Ogihara at michelle@seikausa.com or visit www.seikausa.com.
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.