May 13, 2019 SHENMAO America, Inc. introduces PF719-P250, a new solder paste for automobile electronics. With a wide process window and a variety of unique features, this solder paste is ideal for even the most complicated printed circuit board (PCB) design.
PF719-P250 solder paste meets the requirements for the technologically advanced automotive electronics industry, offering improved reliability and durability necessary for PCB design for automotive applications. This solder paste from SHENMAO features zero halogen and improved insulation reliability, when compared to similar products.
SHENMAO’s PF719-P250 solder paste for automobile electronics meets the industry’s highest standards, providing consistent, reliable performance. This solder paste features excellent voiding performance and solderability. It also prevents head-on-pillow issues that can have an impact on effective PCB design.
For more information, please visit www.shenmao.com. SHENMAO is dedicated to the production of solder products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Solder Preforms, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes.
