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SHENMAO Offers Water-Soluble Solder Paste for SMT and IC Packaging Applications

May 27, 2019

SHENMAO America, Inc. introduces PW215 Water Soluble Solder Paste, ideal for SMT and IC packaging applications. With a wide reflow window, this water soluble solder paste can effectively fit into the design process for even the most complex SMT or IC assembly substrate designs.

SHENMAO’s PW215 Water Soluble Solder Paste features consistent printing performance and a long stencil life. With low residue and low voiding, this formula also has excellent testability.

In addition to water soluble solder paste, SHENMAO also offers a full line of water soluble fluxes, specially designed for SMT and IC assembly applications. The company provides halide-containing and halide-free fluxes for tin and lead as well as lead-free solder alloys. SHENMAO’s formulations have proven to offer an exceptional shell life, stencil life, wetting and clean-ability.


For more information, please visit www.shenmao.com. SHENMAO is dedicated to the production of solder products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Solder Preforms, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes.

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