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X Marks the Spot for Solderstar's New Datalogger at SMTconnect

Mar 25, 2022

Since launching at the end of last year, Solderstar’s innovative new thermal profiler ‘SLX’ has gone from strength to strength thanks to its innovative new additions which will be showcased during SMTconnect Nuremberg from 10-12 May 2022.

The SLX thermal profiler has been designed for operation with no measurement setup making the process of reliable data capture quick and easy. What makes SLX stand out from the crowd is not just the zero setup and configuration but the magic ‘X’. Mark Stansfield, Managing Director at Solderstar explains: “The ‘X’ in SLX stands for EXtendable. We designed this datalogger with the capability to enhance profile information with additional sensors to measure new process parameters. Our first new sensor addition will be previewed during SMTconnect.

“The new SLX process adaptor allows simultaneous capture of both temperature and pressure levels. This is particularly important during the any soldering process performed under vacuum. We are looking forward to presenting the new SLX sensor addition during the event and receiving valued feedback from the electronics production community.”

Many new reflow ovens used in the industry today have the option to add vacuum chambers to the soldering process to help with reducing voids in soldered joints. However, the vacuum level and the rate the vacuum is applied/released are all crucial parameters that are not currently independently measurable along with the temperature profile. “This can be problematic as incorrect vacuum levels can contribute to difficulties with insufficient void removals, or unnecessarily extended hold times in the vacuum. This will reduce product throughput capability of the machine, affect quality and increase process times,” said Mark. “Pulling or releasing a the vacuum too aggressively can also result in component shift issues or solder spatter defects.  The vacuum rate is extremely important and should be monitored carefully and regularly as part of the ovens profile testing. SolderStar’s SLX adapter solves this problem by capturing data of the temperature and vacuum levels at the same time.”

The Solderstar SLX sensor has been designed to be used with vacuum reflow ovens and will be built into the company’s new OvenProbe, a reflow fixture that combines temperature measurement of matched thermal masses. Additionally, the feature includes air temperature and now pressure and vacuum level measurement.

SMTconnect will be used as a platform to present the complete range of SLX accessories together with the SLX reflow system and its improved measurement performance and new cold junction sensor which is accurate to +/- 0.1C.

The latest version of the Solderstar profile analysis software which is available for all the SLX units, will be also be presented to visitors at SMTconnect.  Attendees will be able to learn about SolderStar’s advanced SLX system including the zero setup functionality, powerful multi-memory features and the new vacuum level measurement integration.

To find out more about Solderstar SLX and their other thermal profiling tools and software visit Hall 4 Stand 226 at SMTconnect, 10-12 May 2022 in Nuremberg, Germany.

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