SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Ersa to Present on Void Reduction in Reflow Soldering during SMTAI

Ersa to Present on Void Reduction in Reflow Soldering during SMTAI

Sep 07, 2016

Viktoria Rawinski, Assistant to the CEO.

Viktoria Rawinski, Assistant to the CEO.

Kurtz Ersa North America, a leading supplier of electronics production equipment, is pleased to announce that Viktoria Rawinski, Assistant to the CEO of the Kurtz Ersa Group and head of the Kurtz Ersa Company Museum and the Corporate History Department, will present the paper entitled, “Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate – Process Integration in Industrial Production,” during SMTA International. The presentation is scheduled to take place during Session MFX4, entitled, “Reflow and Soldering Technology: Void Reduction” on Wednesday, September 28, 2016 from 10:30 a.m. to 12 p.m. in Room 49.

Due to the ongoing trend towards miniaturization of power components, the lossless thermal conductivity of solder joints in SMT processes is gaining increasingly more importance. Voids developing during soldering reduce the actual thermal transfer and can cause thermal damage of the power components up to their failure. For this reason, Ersa GmbH has developed a new technique to minimize the formation of those voids during the soldering process and has tested its practicability in industrial soldering processes as well as its influence on process time.

The insights of the feasibility study were the basis for the integration of the void-less technique into an industrial production process. The quality of the solder joint concerning the void rate is strongly influenced by the duration of the void-less process. Therefore, multifold tests were made, contrasting the influence of the process duration as well as the as the influence of the different types of sweeps.

Rawinski graduated from the University of Applied Science in Wuerzburg. She completed Silicat Research (Center Smart Materials) at the Fraunhofer Institute as Engineer for Applied R&D. Her varied fields of research include publications on the dielectric elastomer actuators and the “System Reliability of Piezo-fiber Sensors with Integrated Electronics.” Rawinski leads several emerging technology projects for Ersa GmbH.

For more information about Kurtz Ersa North America, visit www.ersa.com.
 

Apr 03, 2024 -

Kurtz Ersa to Offer Ersa VERSAFLOW 3 – Level ll Maintenance and Application Training Courses in April

Mar 18, 2024 -

Kurtz Ersa Inc. Receives 2024 CIRCUITS ASSEMBLY NPI Award for the VERSAFLOW ONE X-Series

Mar 18, 2024 -

Revolutionizing Soldering: Kurtz Ersa to Debut Cutting-Edge Lineup at APEX

Mar 11, 2024 -

Explore Superior Rework & Soldering Technology from Kurtz Ersa at EPTECH Toronto

Feb 12, 2024 -

Kurtz Ersa Announces Strategic Partnership with Comtree to Enhance Spare Parts Availability in Canada

Nov 20, 2023 -

Kurtz Ersa Inc. Wins 2023 GLOBAL Technology Awards for Rework & Repair and Selective Soldering

Oct 30, 2023 -

Kurtz Ersa Grabs Coveted 2023 Mexico Technology Award for its Alpha 140 3D Printer

Oct 09, 2023 -

Kurtz Ersa Announces Ersa VERSAFLOW 3 – Level ll Maintenance and Application Training Courses in November

Sep 25, 2023 -

Discover Advanced Rework and Soldering Solutions by Kurtz Ersa at SMTA Guadalajara

Sep 11, 2023 -

Ersa Hires New Sales Manager in Indianapolis Area

296 more news from kurtz ersa Corporation »

May 10, 2024 -

ViTrox Presents Next-Gen Intelligent Manufacturing Solutions at SEMICON Southeast Asia 2024

May 10, 2024 -

ViTrox Collaborates with EAMAX to Showcase Cutting-Edge Technologies at Metaltech and Automex 2024

May 09, 2024 -

Purbest | 2024 IPC APEX EXPO Review

May 06, 2024 -

Aven Introduces New 9 Piece E-Z Pik Tweezers Set for Precision Work

May 06, 2024 -

KYZEN to Highlight AQUANOX A4618 and ANALYST2 at SMTA Rocky Mountain Expo and Tech Forum

May 06, 2024 -

VJ Electronix Introduces New Cost-Effective X-ray Inspection Solution with Superior Performance

May 06, 2024 -

Kimchuk, Inc. Elevates Testing Capabilities with Seica PILOT V8 NEXT Flying Probe Tester

May 06, 2024 -

Electronics Industry Sentiment Rose in April, Hitting New High

May 06, 2024 -

IPC's letter to Congress.

May 06, 2024 -

Murray Percival Company Awarded Top Representative of 2023 by MIRTEC

See electronics manufacturing industry news »

Ersa to Present on Void Reduction in Reflow Soldering during SMTAI news release has been viewed 1119 times

  • SMTnet
  • »
  • Industry News
  • »
  • Ersa to Present on Void Reduction in Reflow Soldering during SMTAI
Jade Series Selective Soldering Machines

Reflow Oven