Mar 20, 2013 
EVS International, the World leader in solder recovery, will exhibit the updated, multiple award-winning EVS 1000 Solder Recovery System in Hall 9, Booth 304A at the SMT Hybrid Packaging exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
The new-generation EVS 1000 features all of the recovery performance of its standard and lead-free solder units. The smaller size and footprint helps to reduce cost and carbon footprint, while still providing a capacity of 5 kg/10lb of dross, resulting in rapid ROI as well as substantially improving the wave soldering process and improving productivity. The EVS 1000 can convert waste dross quickly into pure solder in minutes not hours, while improving the wave solder machine process.
This provides a cleaner wave with less maintenance, less downtime, and a significant reduction in rework, shorts and bridging as well as the potential to discontinue the use of messy wave oils and/or dross reduction powders. Additionally, EVS 1000 is designed to enhance ISO-14001 and helps gain or retain this prestigious management standard.
The EVS 1000 is aimed at small- to medium-volume users who typically have one to three wave solder machines and who must regularly dedross or use nitrogen to reduce drossing. This group currently comprises the majority of users in the industry. By using the EVS 1000, nitrogen can be dramatically reduced or eliminated, resulting in significant cost savings.
The EVS 1000 has vastly increased EVS International’s coverage of the wave solder marketplace and has revolutionized its total market penetration, by returning a Very Rapid R O I EVS enhances its Customers profitability.
EVS International’s highly successful EVS 1000 has gained global approval with 16 worldwide industry awards including “Winner of Best Product” and “Product of the Year.”
For more information about EVS International’s industry-leading systems, visit with an EVS International representative in Hall 9 Booth 304A during SMT Hybrid Packaging 2013 or visit www.solderrecovery.com.
