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CyberOptics Awarded Two NPI Awards for SQ3000™ CMM and CyberCMM™ Software

Feb 06, 2020

CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions,was awarded two 2020 NPI Awards in the category of Test and Inspection – SPI for its SQ3000™ CMM and Software – Process Control for its new CyberCMM™ Software Suite. The awards were presented to the company during a Tuesday, Feb. 4, 2020 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.

The world’s first in-line CMM includes an extensive software suite for metrology grade measurement on all critical points. The 3D SQ3000 all-in-one system can identify critical defects and measure critical parameters, providing a superior process control solution for effective yield management. In addition to AOI and SPI applications, highly accurate coordinate measurements can be attained faster than a traditional Coordinate Measurement Machine (CMM) – in seconds, not hours.

Powered by proprietary Multi-Reflection Suppression™ (MRS™) sensor technology, the 3D SQ3000 all-in-one system offers unmatched accuracy by meticulously identifying and rejecting reflections caused by shiny components making MRS an ideal technology solution for a wide range of applications with stringent requirements. The Ultra-High Resolution MRS sensor option delivers superior performance ideally suited for socket metrology, microelectronics and other applications where an even greater degree of accuracy and inspection reliability is critical.

“We are honored to receive two NPI awards for the MRS-Enabled SQ3000 CMM and related software,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics. “Far beyond a pass or fail from inspection, customers are highly valuing the in-line coordinate measurement capabilities we uniquely provide to bolster their process controls.”

CyberCMM™, a comprehensive software suite of coordinate measurement tools provides highly accurate, 100% metrology-grade measurement on all critical points much faster than a traditional CMM, including coplanarity, distance, height and datum X, Y to name a few. A fast and easy set-up can be performed for programming complex applications as compared to slow, engineering resource-intensive set-up that typically requires multiple adjustments with traditional coordinate measurement machines (CMMs).

CyberCMM complements the latest 3D AOI software with ultra-fast programming capabilities, auto tuning and enhancements that significantly speed set-up, simplify the process, reduce training efforts and minimize operator interaction.

Premiering in 2008, the NPI Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.

For more information, visit www.cyberoptics.com.


CyberOptics Corporation (www.cyberoptics.com) is a leading global developer and manufacturer of high-precision 3D sensing technology solutions. CyberOptics’ sensors are used for inspection and metrology in the SMT and semiconductor capital equipment markets to significantly improve yields and productivity. By leveraging its leading edge technologies, the Company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of key vertical markets. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.

Statements regarding the Company’s anticipated performance are forward-looking and therefore involve risks and uncertainties, including but not limited to: market conditions in the global SMT and semiconductor capital equipment industries; the timing of orders and shipments of our products, particularly our 3D MRS-enabled AOI systems; increasing price competition and price pressure on our product sales, particularly our SMT systems; the level of orders from our OEM customers; the availability of parts required to meet customer orders; unanticipated product development challenges; the effect of world events on our sales, the majority of which are from foreign customers; rapid changes in technology in the electronics and semiconductor markets; product introductions and pricing by our competitors; the success of our 3D technology initiatives; the market acceptance of our SQ3000 3D CMM system, products for semiconductor wafer level and advanced packaging inspection and metrology and CyberGage360 product; costly and time consuming litigation with third parties related to intellectual property infringement; and other factors set forth in the Company’s filings with the Securities and Exchange Commission.

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