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MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show

Sep 26, 2012

Mini-Oven Reball/PreBump Unit

Mini-Oven Reball/PreBump Unit

MARTIN will showcase its Mini-Oven Reball/Prebump unit and Expert 10.6 rework system at the upcoming Mississauga EPTECH Electronics Show, scheduled to take place September 27, 2012 at the Mississauga Convention Centre in Canada.

MARTIN’s Mini-Oven 04 Reball/Prebump unit is ideal for the complete QFN solder bumping process, even for the smallest pitches. Using a unique Hotprint Technology, the mask is not removed after printing paste, but remains on the QFN during reflow.

The reballing function is capable of handling a diverse range of BGAs, as well as QFNs and CSPs. Processes can be completed in as little as three minutes. The simple Rapid Technology soldering profiles rigorously apply settings within the permitted thermal limits, heat at the highest advisable thermal ramp rates and maintain a safe temperature zone.  

The unit offers programmable modes and a nitrogen process gas supply. Up to 99 profiles can be accommodated, with the ability to edit individual profiles and fine tune parameters.

For further information, visit MARTIN at the Mississauga EPTECH Electronics Show or online at www.bgarework.com.


MARTIN has developed affordable rework, BGA reballing and dispensing technologies for 30 years with a strong commitment to high quality, precision and reliability. The USA sales and service office is located in Manchester, NH. The company‘s manufacturing facility is in Wessling, Germany. MARTIN is a FINETECH company. 

 

 

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