SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Finetech/Martin Introducing New Rework and Dispense Solutions at IPC APEX 2016

Finetech/Martin Introducing New Rework and Dispense Solutions at IPC APEX 2016

Apr 07, 2016

Finetech/Martin will showcase three new dispense products and a new version of the Mini-Oven BGA/CSP reballing unit in Booth #1259 at the upcoming IPC APEX Conference scheduled for March 15-17, 2016 at the Las Vegas Convention Center.

The Dotliner 07 is an automatic, solder paste and SMT adhesive dispenser capable of dispensing 100 micron dots repeatably. Regardless of whether liquid or paste-like materials are dispensed, no retrofitting of the device is required.  The Dotliner 07 features easy dispense wizard software, closed-loop pressure and temperature control in a small footprint and table-top design.

There will be two new manual dispensers on display that offer a compact package and user display. The Clever Dispense 06 has high speed valves that enable the dispenser to accurately and reliably produce less than 200µm dots and lines. Clever Dispense 06 handles a wide range of viscosities (alcohols to silicones). The Smart Dispense 06 provides accuracy and repeatability at a superior value with a closed-loop pressure control. Nozzle heating and vacuum retract are available as optional features.

The MiniOven 05 is the latest version of this popular reballing and prebumping system, with technical innovations that result in increased performance and operating simplicity. This stand-alone unit reballs micro-BGAs, BGAs and BGA Sockets and prebumps QFNs and leadless devices. Updated firmware provides enhanced process capability and temperature stability, while a new external thermocouple allows closed loop profiling.

Also on display in the booth, the Fineplacer® Core system for advanced rework applications and the Martin 10.6 HXV for large board rework.

Finetech (and subsidiary Martin) offer a wide range of rework, micro-dispensing and bonding equipment solutions. The companies serve customers within the medical, communications, computer, semiconductor, photonics, military, aerospace, and automotive industries, as well as leading universities and research centers. All equipment is design and manufactured in Germany and the US Sales and Customer Support centers are located in Manchester, New Hampshire and Gilbert, Arizona.To learn more about Finetech rework and bonding solutions, please visit

For Martin rework and dispensing products, visit

Jan 14, 2019 -

Finetech to Demo Contactless Residual Solder Removal at IPC APEX 2019

Nov 27, 2013 -

Martin Streamlines and Simplifies Rework with New Process Shuttle

Nov 08, 2013 -

Finetech Unveils High Force ACF Bonder

May 28, 2013 -

Al Cabral Joins Finetech as Regional Sales Manager

Mar 11, 2013 -

Donated Finetech Die Bonder Installed at Pennsylvania State University

Jan 16, 2013 -

Finetech to Exhibit the Ideal Blend of Performance and Cost Rework Technology at the 2013 IPC APEX EXPO

Jan 04, 2013 -

Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West

Oct 03, 2012 -

The Best in Rework Technology – Finetech to Exhibit FINEPLACER® Core Rework System at SMTA International

Sep 26, 2012 -

MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show

Sep 10, 2012 -

MARTIN to Participate in Package on Package (PoP) Design and Assembly Center SMTA International 2012

77 more news from Finetech »

May 24, 2022 -

Electric Stencil Cleaner HJS-9500,high quality aqueous detergent stencil cleaning machine

May 23, 2022 -

Blackfox/Evolution Announce Updated Veteran Advanced Manufacturing Certification Program

May 23, 2022 -

New Yorker Electronics announces release of Inolux Tri-Color Side View LED Series

May 22, 2022 -

Online PCBA Cleaning Machine HJS-7600

May 21, 2022 -

Mis-print PCB Cleaning Machine HJS-3600

May 20, 2022 -

Vitrek Acquires MTI Instruments, Expanding Its Portfolio of Precision Measurement Solutions

May 18, 2022 -

KYZEN to Discuss Precision Metal Cleaners at MECSPE 2022

May 18, 2022 -

Specialty Coating Systems to present Specialized Coatings for Advanced Medical Devices Webinar

May 18, 2022 -

Award-Winning Murray Percival Co. Brings Ersa Rework System to L3Harris

May 18, 2022 -

Complete in-line AOI process control at an affordable price point

See electronics manufacturing industry news »

Finetech/Martin Introducing New Rework and Dispense Solutions at IPC APEX 2016 news release has been viewed 611 times

  • SMTnet
  • »
  • Industry News
  • »
  • Finetech/Martin Introducing New Rework and Dispense Solutions at IPC APEX 2016
Voidless Reflow Soldering

MSD Dry Cabinets