Nov 15, 2007 Milara takes its combined system technology practice one step further with the development of the AWPb 300 Wafer Bumper / Printing system. The system is a creative and cost efficient application of Milara�s existing technology and is capable of handling 150, 200 and 300 mm cassettes with either a single or dual FOUP option. A single robotic arm with pre-aligner is used to load and unload wafers onto the automated print stage (EFEM). Using Milara�s patented vibration squeegee technology, which has proven viability in wafer bumping, the AWPb 300 uses the same technology used by all Milara printers to accomplish ultra-fine-pitch printing. The unique �start� configuration design allows the AWPb 300 to be configured with a post-wafer reflow batch oven and wafer cleaning system to offer a full process module while boasting the smallest footprint in comparison to other systems.
The AWPb 300 fully automatic robotic wafer bumper offers advanced technological features and combines them with unprecedented ease of operation at one low price. The AWPb 300 is engineered to provide significant speed and throughput improvements by achieving the highest levels of precision and consistency in paste deposition. Self-diagnostic software is utilized for instant troubleshooting to ensure maximum productivity as well as to simplify maintenance and increase repairability.
The Global Technology Awards program is sponsored by Global SMT & Packaging Magazine, and is an annual celebration of product excellence in semiconductor packaging and electronics assembly. Premier products based on the finest examples of creative advancement in technology in 23 key areas are chosen by a distinguished panel of global industry experts.
Milara Inc. is a leading vendor of fully and semiautomatic stencil printers for SMT and semiconductor applications. Contact Milara at 4 Marc Rd., Medway, MA 02053; (508) 533.5322; Fax: (508) 533.8686; Web site: http://www.milarasmt.com
