Nihon Superior Co. Ltd. is pleased to announce that Keith Sweatman, Senior Technical Advisor, will participate in a panel discussion on Tuesday, Dec. 8, 2020 at 7:30 a.m. PCT / 10:30 a.m. EST / 3:30 p.m. GMT / 4:30 p.m. CET. The panel discussion is entitled “Low temperature solders – revisited.”
Following the highly successful panel discussion in June, this panel will revisit this topic to learn more about some of the latest techniques, materials and processes to meet the challenge of working with low-temp solders. To register, visit https://us02web.zoom.us/webinar/register/WN_uT6QdlrkQAC0eaBZ13MIeQ.
Sweatman is a graduate in metallurgical engineering who has been involved in the solder industry and soldering technology for more than 45 years. He has been an active participant in several HDPUG and iNEMI consortia projects relating to lead-free solder performance and reliability and is a regular speaker at IPC and SMTA conferences.
Nihon Superior continues to offer solutions to the challenges facing the electronics industry, such as improvements in reliability, thermally stable joining, and lead-free die attach. For more information about Nihon Superior’s new flux-cored wire, solder pastes and lead-free products, visit www.nihonsuperior.co.jp/english.
Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products, Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries, and the United States, and formed business partnerships with companies in other markets.