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Nihon Superior to Highlight TempSave Soldering Materials and SN100CV P608 Paste at SMTAI

Oct 07, 2021

Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #3301 at the SMTA International Exposition, scheduled to take place Nov. 3-4, 2021 at the Minneapolis Convention Center in Minneapolis, MN. The company also will showcase SN100CV P608 solder paste.

Nihon Superior’s TempSave™ series of low temperature soldering materials has been designed to address the industry’s goals of reduced peak reflow temperature to reduce defects contributing to package warpage, reduce energy consumption during the reflow process, and avoid potential damage to temperature sensitive devices. TempSave B58 is a eutectic SnBi alloy with a melting point of 139°C while TempSave B37 is aductile hypoeutectic SnBi alloy anddoes not contain Ag.

High bismuth containing alloys are known to be brittle and therefore poor in drop shock performance. However, TempSave B37 has outstanding drop performance, even dramatically outperforming SAC305. The halogen-free P610 flux medium is specifically designedfor Bi alloys.  The TempSave B37 P610 solder paste can be reflowed with a peak temperature of 190°C.Additionally, TempSave B37 is available as a flux cored wire.

SN100CV®P608is a completely halogen free, lead-free, no-clean solder paste. Unlike silver-containing alloys that derive their strength from a dispersion of fine particles of eutectic Ag3Sn, SN100CV gains its strength from solute atoms in the tin matrix of the joint. Although silver-free, in tensile tests the SN100CValloy matches the strength of SAC305 while maintaining a high level of resistance to impact loading.LF-C2is a high reliabilitylead-free alloy as it uses both dispersion and solid solution strengthening. With a liquidus temperature of 213°C it can be reflowed at a lower temperature than SAC305.

The P608 flux medium provides wetting comparable with that of halogen containing paste even though it is completely halogen-free.  SN100CV P608 and LF-C2 both deliver excellent performance over a wide range of component types and process parameters.

Nihon Superior continues to offer solutions to the challenges facing the electronics industry, such as improvements in reliability, thermally stable joining, and lead-free die attach. For more information about Nihon Superior’s new alloys, solder pastes and lead-free products, please visit us at www.nihonsuperior.co.jp/english.


Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products, Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries, and the United States, and formed business partnerships with companies in other markets.

Jan 03, 2022 -

Nihon Superior to Highlight TempSave Soldering Materials at IPC APEX

Feb 08, 2021 -

Nihon Superior Receives Honorable Mention in SMTA International Best Paper Awards

Jan 06, 2021 -

Nihon Superior Commemorates 55 Years of Innovation in Soldering Materials

Dec 04, 2020 -

Nihon Superior's Senior Technical Advisor will participate in Low Temperature Solder Panel Discussion

Feb 06, 2020 -

Nihon Superior Receives NPI Award for New TipSave N Flux-Cored Solder Wire

Feb 06, 2020 -

Nihon Superior Wins 2020 IPC APEX EXPO Innovation Award for New Flux-Cored Solder Wire

Jan 06, 2020 -

Nihon Superior to Exhibit TipSave N at APEX 2020

Oct 29, 2019 -

Nihon Superior extends soldering iron tip life by 3X with new TipSave N flux-cored solder wire

Aug 21, 2019 -

SN100C Celebrates 20 Years of Reliability Service

Aug 17, 2019 -

Nihon Superior to introduce TipSave N flux-cored solder at NEPCON Asia

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