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Nihon Superior to Present During the 2007 IPC/JEDEC International Conference on Lead-Free Electronics

Dec 03, 2007

OSAKA, JAPAN � November 30, 2007 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, announces that it will present during the IPC/JEDEC International Conference on Lead-Free Electronics and Tabletop Exhibition that is scheduled to take place December 3-5, 2007 at the Driskill Hotel in Austin, Texas.

Nihon Superior�s presentation will take place on December 4, 2007 at 10:45 a.m. The paper, �Impact Strength of Lead-Free BGA Spheres,� will be presented by Keith Sweatman.

Additionally, Nihon Superior will have a tabletop exhibition. A company representative will be available to discuss the company�s products and technologies.

With the RoHS directive in place, the demand for advice and solutions is increasing dramatically. The IPC and JEDEC are holding this international lead-free conference to give the electronics industry answers to the challenges of implementing lead-free processes.

About Nihon Superior Co. Ltd.

Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. Since then, the company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. Backed by its knowledge of these technologies, Nihon Superior has developed into a global company by establishing manufacturing and sales centers in Japan as well as in Asia and China, and by forming business partnerships with overseas companies.

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