Dec 25, 2023 Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, will be exhibiting at the 38th Nepcon Japan at the Tokyo Big Site Exhibition Center. From January 24 to 26, visitors to the show will discover Saki’s state-of-the-art inline total inspection line solutions for Smart Factories and latest hard- and software innovations in the “Electrotest Japan” exhibition area on Booth 15-2 (East Hall 2) as well as on Booth 35-14 (East Hall 4) in the brand new “Power Device & Module Expo” area.
Saki will offer booth-visitors a first-hand look at the unique features that demonstrate its Full SMT Line, Smart Factory and M2M capabilities. These include the latest hardware and software releases with an emphasis on total inspection line solutions that offer reliability, speed, quality, and value for applications across key sectors including automotive, EMS, and industrial markets.
The show line-up will feature:
Electrotest Japan - Booth 15-2 (East Hall 2)
Saki's innovative single operation capabilities, together with a prototype of their software system called “One Programming / Saki Link”, will serve as a showcase for the company's data-driven approach to ongoing productivity enhancement. SPI, AOI, and AXI programming operability is unified, and device configurations are done in batches using a shared data library.
Alongside the new software system, QD Analyzer and Multi Process View (MPV) demo station will present Saki’s software strength that greatly improves process troubleshooting and determines root causes. These innovations will help clients increase automation to solve labor & resourcing issues, tackle skills shortages, improve productivity and achieve greater manufacturing quality and efficiency.
Power Device & Module EXPO – Booth 35-14 (East Hall 4)
The Power Device and Module Expo is a new addition to Nepcon Japan focusing on the automotive, energy, railroad, and industrial equipment sectors. Designed specifically for the power semiconductor manufacturing applications, Saki will exhibit its latest X-ray total automatic inspection system for power modules, the AXI 3Xi-M200, on a dedicated Saki booth #35-14 in East Hall 4.
With its special Planar-CT (PCT) scanning method, combined with advanced in-house image-processing algorithms that calculate the luminance of each pixel in three dimensions to reconstruct images with the maximum possible accuracy, Saki’s X-ray solution fulfills inspection capabilities and flexibility required by semiconductor manufacturers far beyond standard SMT inspection processes with precision, speed, and ease.
“We are looking forward to once again showcasing our latest technologies at Nepcon Japan. With our range of inspection machine and software solutions we aim to help address changes and challenges faced by electronic manufacturers today and in the future,” said Ken Katsumi, Chief Sales Manager of Saki’s Sales Headquarter.
For more information about Saki visit www.sakicorp.com/en/.
Since its inception in 1994, Saki has led the way in the development of automated recognition through robotic vision technology. Saki's 3D automated solder paste, optical, and X-ray inspection and measurement systems (SPI, AOI, AXI) have been recognized to provide the stable platform and advanced data capture mechanisms necessary for true M2M communication, improving production, process efficiency, and product quality. Saki Corporation has headquarters in Tokyo, Japan, with offices, sales, and support centers around the world.
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