Feb 19, 2015 
In the last couple of years Bob has produced two free EBooks for engineers, each with over 100 pages of information, tips and illustrations to make introduction easier. Both titiles are based on practical experience using these techniques in manufacture in different sites.
Our titiles include:
Package On Package Assembly Inspection & Quality Control
Downloaded at http://www.packageonpackagebook.com/
Pin In Hole Intrusive Reflow Desing & Assembly
Download at http://pihrtechnology.com/
Package On Package Assembly Inspection & Quality Control
Topics will include:
Package On Package Assembly Overview
Component packaging
Printed Circuit Board Design
PCB Solder Finishes
Solder Paste Printing
Automatic Optical Inspection
PoP Component Placement
Convection & Vapour Phase Reflow & Profiling
Optical & X-ray Inspection
Cleaning PoP Assemblies
PoP Underfill & Staking
Rework & Reballing Package on Packages
Conformal Coating
Reliability Testing Package On Package
POP Process Assembly Defects
PoP Technical Training Material & Services
PoP Technical Paper Bibliography
Introduction to Pin in Paste Intrusive Reflow
Topics will include:
Pin In Hole Reflow PCB Design Guidelines
PIHR Component Guidelines
Solder Paste Application Methods
Automatic and Manual Component Placement
Reflow SolderingTemperature
Profiling for Pin In Paste Reflow
Solder Joint Inspection and Quality Control
Reliability of Through Hole Reflow
PIHR Manufacturing Defects – Causes and Cures
PIHR Bibliography
PIHR Frequently Asked Questions
