SMT, PCB Electronics Industry News

Bob Willis Malaysia Workshop in June

Mar 17, 2015

On land or under the sea he has a solution

On land or under the sea he has a solution

Conformal Coating, Bottom Mounted Components and Robotic Soldering are featured workshops presented by Bob to coincide with Nepcon Malaysia. The Knowledge Group have invited Bob to present three one day workshops in Penang 9-11th June.

For further information visit http://knowledgegroupco.com/index.php/component/jcalpro/events/day?date=2015-06-09

The workshops include

BMC (Bottom Mounted Component) LGA (Land Grid Array) QFN (Quad Flat No-lead) Design, Assembly & Rework Guide
Conformal Coating Applications, Inspection, Rework & Quality Control
High Temperature Electronic Manufacture with Selective, Laser and Robotic Point Soldering

BMC (Bottom Mounted Component) LGA (Land Grid Array) QFN (Quad Flat No-lead) Design, Assembly & Rework Guide
Bob Willis  bobwillisonline.com

Workshop Introduction:

LGA and QFN have fast become a common package type often used in many professional portable products. With any new device type there is always a learning curve for design, process and quality engineers who have to get to grips with the challenges that these packages bring. Each step of the implementation process for LGA/QFN devices will be reviewed along with results of practice process trials with these devices. Included with this workshop will be a set of optical and x-ray inspection charts for each delegate to use in manufacture. The workshop presenter is well known for his practical workshops and supported by Bob Willis unique process video experiments LGA/QFN are guaranteed to come alive.

Who should attend?

This workshop is designed for design, process and quality engineers responsible for introducing products containing LGA/QFN. Much of the material presented is extremely visual and practical making it ideal for manufacturing staff, like all the instructors workshops it not just theory, it’s a “How to Do It Session”

Workshop Topics Included:


Component Package Types
Component Construction
MSD Handling Levels
Solderability Testing Packages
Printed Board Layout on Rigid and Flexible Circuits
Solder Mask Layout Options
Lead-Free Stencil Printing Options
Placement and Component Packaging
Convection and Vapour Phase Soldering Yields
Visual Inspection Criteria
X ray inspection Criteria
LGA/QFN Rework and Replacement
Array Solder Joint Reliability
Common Process Problems with LGA/QFN

Conformal Coating Applications, Inspection, Rework & Quality Control Workshop
Bob Willis bobwillisonline.com

Workshop Introduction:

The use of Conformal coating has provided benefits to industry for many years either in the high reliability market sector or where products have to deal with extreme environmental conditions or simply in use in consumer applications. The use of coatings is seen in different industries like telecommunications, automotive and consumer products have benefited from the use of selective coating but for different reasons.

This workshop will provide a simple guide to the use of coatings, their application and process, product benefits, inspection and quality control. A practical session will also allow delegates to examine coated boards using different materials and inspect the coating application.

Each delegate will also receive a FREE set of colour Inspection Wall Charts covering coating application and common defects to use on their manufacturing shop floor. During each workshop there are opportunities to win some of Bobs interactive CD ROMs for best questions of the session.

Who should attend?

This workshop is designed for design, process and quality engineers responsible for introducing coating materials, inspection or auditing presented is extremely visual and practical making it ideal for manufacturing staff, like all the instructors workshops it not just theory, it’s a “How to Do It Session”

Workshop Topics Included:

Why Conformal Coat
Clean or No Clean
Coating Material Options
Coating Process Options
Cost of coating assemblies
SIR and cleanliness testing
Cleanliness testing methods
Reliability of Coating
Testing & Evaluation of Coatings
Correct design for coating
Masking options and methods
Inspection & Quality Control of Coating
In-house or Contracting Services
Inspection of coatings & methods
Rework & repair of board assemblies

Nov 09, 2023 -

New Soldering Book plus all of Bobs Libray FREE to download

Aug 22, 2023 -

Bob's New Charity Soldering Book Free to Download in November

Aug 02, 2023 -

FREE Guide to Robotic Soldering from Bob Willis

May 01, 2023 -

Robotic Soldering eBook from Bob Willis

Nov 05, 2021 -

Robotic Soldering Success & Low Temperature Assembly & Inspection

Apr 05, 2021 -

Your Process Defect Solved with Bob Willis

Jan 22, 2021 -

Bob Willis Soldering Workshops Back at IPC APEX

Nov 14, 2020 -

Bob Willis 2021 Online Webinars Launched

Oct 02, 2020 -

Robotic Soldering - How to Benefit

Sep 01, 2020 -

Robotic Soldering Experience with Bob Willis

102 more news from ASKbobwillis.com »

May 10, 2024 -

ViTrox Presents Next-Gen Intelligent Manufacturing Solutions at SEMICON Southeast Asia 2024

May 10, 2024 -

ViTrox Collaborates with EAMAX to Showcase Cutting-Edge Technologies at Metaltech and Automex 2024

May 09, 2024 -

Purbest | 2024 IPC APEX EXPO Review

May 06, 2024 -

Aven Introduces New 9 Piece E-Z Pik Tweezers Set for Precision Work

May 06, 2024 -

KYZEN to Highlight AQUANOX A4618 and ANALYST2 at SMTA Rocky Mountain Expo and Tech Forum

May 06, 2024 -

VJ Electronix Introduces New Cost-Effective X-ray Inspection Solution with Superior Performance

May 06, 2024 -

Kimchuk, Inc. Elevates Testing Capabilities with Seica PILOT V8 NEXT Flying Probe Tester

May 06, 2024 -

Electronics Industry Sentiment Rose in April, Hitting New High

May 06, 2024 -

IPC's letter to Congress.

May 06, 2024 -

Murray Percival Company Awarded Top Representative of 2023 by MIRTEC

See electronics manufacturing industry news »

Bob Willis Malaysia Workshop in June news release has been viewed 1079 times

One stop service for all SMT and PCB needs

Thermal Interface Material Dispensing