SMT, PCB Electronics Industry News

Solder Squeeze Out on Underfilled Boards - Defect of the Month

Jul 03, 2018

Red hot at solving process problems

Red hot at solving process problems

Solder Squeeze Out on Underfilled Boards

Solder migration or Squeeze Out can be seen when solder reflows on packages which are underfilled and is feature on the NPL Defect Database and shows you what is happening. The video sequence of the BGA with underfill and solder being squeezed out was taken on a Dage X-Ray system with reflow video simulator The video is just one of the Defect of the Month videos featured by IPC, SMTA and Circuits Assembly to help provide better understanding of process issues and help support training of younger engineers

Past Defect of the Month pages are available online at Circuits Assembly magazine or the videos at 

The defect database is free to use or add defects and can be accessed via  In addition the database includes 100’s of the NPL reports that can be downloaded free

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