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AI-powered Inspection Solutions from TRI at SEMICON Taiwan 2021

Dec 07, 2021

Test Research, Inc. (TRI) will join NEPCON Asia held at Taipei Nangang Exhibition Center, Hall 1 from December 28 – 30, 2021. Visit booth #I3116 to experience the latest in Smart Factory Semiconductor Inspection. 

Join TRI at SEMICON Taiwan 2021 to discover TRI's AI-powered Inspection solutions. TRI will showcase the recently released 3D SPI, TR7007Q Plus, equipped with an improved motion controller and enhanced 2D lighting for sharper inspection images.

Also exhibiting will be the 3D Semiconductor and Advanced Packaging Optical Inspection TR7900Q SII for semiconductor industry applications with built-in magazine loader/unloader, 2.5 µm high resolution, and an outstanding 25MP camera. The TR7900Q SII can inspect Die Bonding, Ball Bonding, Wire Bonding, Epoxy, and Foreign Material Detection. The 2021 SEMICON Taiwan lineup will include an offline X-ray Inspection Demo with CT capabilities. TRI will also showcase the AI Verify Host, the AI-powered repair station that reduces the need for manual re-inspection and lowers operational costs.

Realize your production line's potential with TRI's Test and Inspection solutions and Industry 4.0 data-driven management system, YMS 4.0. TRI's systems are designed to interoperate with other manufacturing equipment to minimize downtime, optimize production quality, and reduce operator workload.

Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs), In-Circuit Test equipment (ICT), and Functional Testing (FCT), TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at For sales and service information, please write to us at or call +886-2-2832 8918.

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