SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • SEMICON WEST 2018 starts next Tue July 10th! VISIT YINCAE BOOTH 5269

SEMICON WEST 2018 starts next Tue July 10th! VISIT YINCAE BOOTH 5269

Jul 03, 2018

Underfill Tree Poster

Underfill Tree Poster

(Albany, NY) July 3, 2018 – SEMICON West 2018, North America’s premier Microelectronics event, is just one week away! The show will be held at the Moscone Center in San Francisco, CA from July 10th to 12th. YINCAE sincerely invites you to stop by our Booth #5269 to speak with our experts and to see what’s new.


We are noticing an emerging trend in underfill and thermal materials and would love to showcase a wide range of materials varying from the World’s first commercial diamond underfill, to a high filler-load underfill that can flow into small gaps at room temperature, a solder joint encapsulant paste that has low temperature reflow and high pull strength at high temperature (300℃), a reflowable (filled) underfill that is excellent for applications with a narrow footprint and lastly, a mold underfill with a 90% filler load able to flow into 25μm gap without external force.


These are the materials you need and YINCAE Advanced Materials, LLC hopes that you are finalizing preparation for the SEMICON WEST 2018. We are looking forward to seeing you in the Moscone Center at booth 5269 and will be available to talk about our products and answer any inquiries you may have. We hope that you will join us at the conference to learn about our exclusive products that no other company offers. We look forward to seeing you at booth 5269!


If you wish to schedule a booth meeting,
please email us at info@yincae.com or call (518) 452-2880
* * * * * * * * * *
Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.
###
The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

Sep 04, 2018 -

YINCAE’s New Underfill with Zero Outgassing: SMT 158HA

Jul 19, 2018 -

YINCAE at IWLPC 2018

Jul 03, 2018 -

SEMICON WEST 2018 starts next Tue July 10th! VISIT YINCAE BOOTH 5269

May 18, 2018 -

YINCAE’S SMT 158A Receives High Praise

May 14, 2018 -

YINCAE’S New Highly Conductive Thermal Underfill: SMT 158D

May 08, 2018 -

SEMICON WEST 2018 is in 1 Month! VISIT YINCAE BOOTH 5269

Apr 09, 2018 -

An Innovation Reliability Solution to Interconnect of Flexible/Rigid Substrates

Mar 30, 2018 -

SEMICON West is 3 months away! Visit YINCAE at Booth #5269

Feb 14, 2018 -

Press Release: DA 150 High Temperature, Fast Cure Die Attach Adhesive Series Materials

Feb 14, 2018 -

Press Release: DA 90 Low Temperature Die Attach Adhesive Series Materials

28 more news from YINCAE Advanced Materials, LLC. »

Nov 14, 2018 -

Data I/O Wins Mexico technology Award, the 5th Industry Award for Universal Flash Storage (UFS) Support on LumenX® Data I/O Sweeps the 2018 Industry Awards Season for UFS support on LumenX

Nov 14, 2018 -

KYZEN Receives Two Mexico Technology Awards

Nov 14, 2018 -

Juki Wins Three Mexico Technology Awards for Storage, Printing and Pick-and-Place

Nov 14, 2018 -

Growth at Texcel Drives Investment in Two iineo+ Placement Machines.

Nov 14, 2018 -

Executive Forum at IPC APEX EXPO Focuses on Advancing Automotive Electronics

Nov 14, 2018 -

Indium Corporation to Feature Indium8.9HF Solder Paste at IPC APEX EXPO 2019

Nov 14, 2018 -

Manual X-ray inspection by Viscom, intelligently networked and with cobots

Nov 14, 2018 -

Viscom implements groundbreaking 3D technology across its entire product range

Nov 14, 2018 -

Viscom presents advantages of 3D bond inspection at electronica

Nov 14, 2018 -

User-friendly inspections of protective coatings with the S3088 CCI system by Viscom

See electronics manufacturing industry news »

SEMICON WEST 2018 starts next Tue July 10th! VISIT YINCAE BOOTH 5269 news release has been viewed 224 times

  • SMTnet
  • »
  • Industry News
  • »
  • SEMICON WEST 2018 starts next Tue July 10th! VISIT YINCAE BOOTH 5269
pcb components vacuum pick up

Training Services