SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • SEMICON WEST 2018 starts next Tue July 10th! VISIT YINCAE BOOTH 5269

SEMICON WEST 2018 starts next Tue July 10th! VISIT YINCAE BOOTH 5269

Jul 03, 2018

Underfill Tree Poster

Underfill Tree Poster

(Albany, NY) July 3, 2018 – SEMICON West 2018, North America’s premier Microelectronics event, is just one week away! The show will be held at the Moscone Center in San Francisco, CA from July 10th to 12th. YINCAE sincerely invites you to stop by our Booth #5269 to speak with our experts and to see what’s new.


We are noticing an emerging trend in underfill and thermal materials and would love to showcase a wide range of materials varying from the World’s first commercial diamond underfill, to a high filler-load underfill that can flow into small gaps at room temperature, a solder joint encapsulant paste that has low temperature reflow and high pull strength at high temperature (300℃), a reflowable (filled) underfill that is excellent for applications with a narrow footprint and lastly, a mold underfill with a 90% filler load able to flow into 25μm gap without external force.


These are the materials you need and YINCAE Advanced Materials, LLC hopes that you are finalizing preparation for the SEMICON WEST 2018. We are looking forward to seeing you in the Moscone Center at booth 5269 and will be available to talk about our products and answer any inquiries you may have. We hope that you will join us at the conference to learn about our exclusive products that no other company offers. We look forward to seeing you at booth 5269!


If you wish to schedule a booth meeting,
please email us at info@yincae.com or call (518) 452-2880
* * * * * * * * * *
Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.
###
The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

Jul 15, 2019 -

YINCAE Advanced Materials to Exhibit and Present at IMAPS 2019 Boston 52nd International Symposium on Microelectronics

Apr 10, 2019 -

IMAPS New England Symposium & Expo 2019 is just 4 weeks away! Visit YINCAE on May 7, 2019

Mar 12, 2019 -

YINCAE Advanced Materials to Exhibit and Present at IMAPS New England Symposium & Expo 2019

Dec 31, 2018 -

YINCAE at iMAPS New England

Dec 31, 2018 -

YINCAE at iMAPS 2019- Boston

Dec 28, 2018 -

YINCAE at IPC APEX EXPO 2019

Nov 29, 2018 -

APEX 2019 starts January 26th! VISIT YINCAE BOOTH 1720

Sep 04, 2018 -

YINCAE’s New Underfill with Zero Outgassing: SMT 158HA

Jul 19, 2018 -

YINCAE at IWLPC 2018

Jul 03, 2018 -

SEMICON WEST 2018 starts next Tue July 10th! VISIT YINCAE BOOTH 5269

35 more news from YINCAE Advanced Materials, LLC. »

Jul 16, 2019 -

The Murray Percival Company Announces Exciting New Partnership with KYZEN

Jul 16, 2019 -

Metcal to Demo Its Innovative Solder Tip Cleaner at the SMTA Heartland Expo

Jul 16, 2019 -

Non-contact Jet Valve from PVA at SMTA Ohio Expo

Jul 16, 2019 -

VJ Electronix to Show New, Improved Component Counting System and the Industry’s Most Reliable Rework System at NEPCON Shenzhen

Jul 16, 2019 -

International Wafer-Level Packaging Conference (IWLPC) Program Announced and Registration Now Open

Jul 16, 2019 -

Count On Tools Signs Representative Agreement with SW Systems Technology

Jul 16, 2019 -

Datest Passes AS9100D Recertification

Jul 16, 2019 -

CyberOptics NanoResolution MRS Sensor Wins 2019 Best of West Award at SEMICON West

Jul 16, 2019 -

East/West Manufacturing Enterprises Announces Banner 1H

Jul 16, 2019 -

XJTAG Extends the Power of Boundary Scan Testing

See electronics manufacturing industry news »

SEMICON WEST 2018 starts next Tue July 10th! VISIT YINCAE BOOTH 5269 news release has been viewed 437 times

  • SMTnet
  • »
  • Industry News
  • »
  • SEMICON WEST 2018 starts next Tue July 10th! VISIT YINCAE BOOTH 5269
pcb inspection, aoi, spi - asc international

flying probe test services