Jun 01, 2011 
Indium Corporation Senior Technical Support Engineer Chris Nash will present his technical findings at the Huntsville SMTA Expo and Tech Forum on June 22, in Huntsville, AL.
Chris will present Pb-free Materials, Process, and Reliability Abstract. This paper provides a review of Pb-free soldering processes and materials to help build the base for a discussion on some more recent Pb-free defects. Techniques and materials that help mitigate head-in-pillow and graping issues will also be discussed in depth.
Chris provides comprehensive technical advice in the selection, use, and application of solder paste, flux, and solder alloy fabrications to customers in the electronics assembly, optoelectronic, semiconductor, and related industries. He has authored numerous process and technical guidelines and has presented at several industry forums and conferences. Chris is a member of the SMTA and participates actively in the occasional IPC standards development committee.
Chris has a bachelor's degree from Clarkson University. He is certified as a Six Sigma Green Belt from Dartmouth College's Thayer School of Engineering. He has earned his certification as an SMTA Process Engineer and is a certified IPC-A-600 and IPC-A-610D Specialist. Chris is based at Indium Corporation’s global headquarters in Clinton, NY.
For more information about the Huntsville SMTA Expo and Tech Forum, visit
Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
