Cobar Solder Products to Exhibit SN100C-XF3+ Solder Paste and Wire at the SMTA Ohio Valley Expo & Tech Forum

Jul 13, 2011

Cobar Solder Products’ XF3+ lead-free solder paste accommodates extended reflow profiles with or without the use of nitrogen.

SN100C- XF3+ solder wire performs better in eliminating voiding when compared to any SAC-alloy.

The Balver Zinn Group announces that Cobar Solder Products Inc. will exhibit its lead-free SN100C-XF3+ solder paste and wire at the upcoming SMTA Ohio Valley Expo & Tech Forum, scheduled to take place Thursday, July 14, 2011 at the Doubletree Hotel in Cleveland, OH.

Cobar Solder Products’ XF3+ lead-free solder paste accommodates extended reflow profiles with or without the use of nitrogen. With XF3+, wetting on all common pad finishings is excellent, yielding shiny joints reminiscent of leaded solders. It also exhibits a robust printing window.

SN100C- XF3+ performs better in eliminating voiding when compared to any SAC-alloy. XF3+ paste provides improved print performance, as well as long stencil life. It also allows reflow without N2 and offers a high tack force/time.

Cobar Solder Products is the U.S. division of the Balver Zinn/Cobar Group.

Cobar Solder Products to Exhibit SN100C-XF3+ Solder Paste and Wire at the SMTA Ohio Valley Expo & Tech Forum news release has been viewed 1241 times

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