ACD Debuts Flight Status for Real-Time Order Tracking

ACD, a leading supplier to the electronics industry, introduces its Flight Status Board Tracking System, leveraging state-of-the-art programming techniques to track the progress of circuit boards throughout the manufacturing process.

“Flight Status is a great tool that allows each process center to see what product is ready to be worked on. We also allow all areas to see defects in real-time, giving us the ability to respond to issues in process as opposed to a post-mortem report after the build is complete. This gives ACD a huge competitive advantage over our competitors for prototype, pilot and production builds,” commented W. Scott Fillebrown, President & CEO.

Flight Status is visible for employees to track the status of their orders at any point in the manufacturing process. Touch-screen displays present a real-time list of projects and board counts within specific process centers, including the quantity of boards in previous and subsequent process centers. An assembler can touch the line for a specific project to drill down into information relevant to that specific project in process, such as the enforced route and contact information.

The Flight Status system displays are prominent and highly-visible in specific process centers. Determining board status no longer requires reliance on email and all of the uncertainties that plague email systems. Leveraging information-at-a-glance, assemblers are better able to anticipate and prepare for machine turnaround and setup for the next job since they can see when they are nearing the end of the quantity of boards for the current run. The immediacy of ACD’s Flight Status System dramatically increases reliability, certainty and predictability of information distribution to meet the real-time demands of the high-mix electronics manufacturing process.

ACD is a leading supplier to the electronics industry. Founded in 1984, ACD’s services comprise complete board layout services, ATE engineering services, DFM/DFA capability, printed circuit fabrication, component procurement, SMT and through-hole build, rework, X-ray, flying probe and functional test, and development.