Jul 27, 2011 
Product Thermal Profiling at Las Vegas LED Show July 27th.
SinkPAD Corporation’s Vice President of Marketing and Business development Sam Bhayani has announced that his company SinkPAD Corporation will be performing comparative thermal profiling right at their booth (#264) next week at the LED show in Las Vegas July 27th.
Bhayani commented, “We are very excited about this opportunity to demonstrate just how well a SinkPAD PCB draws heat from an LED versus a conventional MCPCB and provide evidence in numbers by measuring side by side temperatures of the LED junction, PCB, and heat sink by use of an IR Thermal Camera. Anyone who is looking for a solution to better thermally manage their LED’s shouldn’t miss it and we hope will take advantage of scheduling a private demo to fully understand how SinkPAD manages heat and what that can mean to them or even take the next step and set up a similar thermal analysis specific to their product”
Those interested in scheduling a private demo at the show can contact Kris Vasoya at 714-660-2944 Ext. 1001 or email him at Kris.vasoya@sinkpad.com
SinkPAD will be exhibiting at the LED show in Las Vegas on July 27th. The LED show and conference is on July 26th and 27th, the conference is both days while the expo is on the 27th.
SinkPAD corporation’s new thermal technology printed circuit boards are a complete and effective solution to the challenges faced by the solid state lighting industry, specifically those with aluminum LED PCB applications.
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SinkPADTM conducts heat out of the LED system (LED cooling) by enabling a direct thermal path between the LED and surrounding atmosphere, which eliminates thermal resistance introduced by the dielectric material in a traditional IMS PCB or MCPCB. The SinkPADTM design completely removes the substance with the lowest thermal conductivity/highest thermal resistance from the structure. SinkPADTM still uses a dielectric, but this dielectric isolates the metal base electrically and leaves it thermally connected. The thermal path should be electrically neutral within the LED package, i.e. Cree XLamp, Luxeon Rebel from Philips Lumiled, PhlatLight from Luminus, in order to solder the LED directly to the SinkPADTM. To find out how SinkPAD’s technology can remove the heat in your LED application, contact SinkPADTM Corporation or visit the SinkPAD website, www.sinkpad.com.
SinkPAD Corporation is an innovative thermal management company addressing the thermal challenges facing the electronics industry. The company’s patent pending PCB technology makes it possible to conduct heat out of the LED system and into the atmosphere quickly and cost effectively while providing their customers with a first-to-market competitive advantage.
