Sep 19, 2011 
STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, introduces its new Micro-Coil Spring Array as an improved alternative to standard rigid arrays.
The Micro-Coil Spring Array has been designed to replace the column grid array (solder columns) commonly used on integrated circuits (IC) with high lead counts. The Micro-Coil Spring Array was developed by NASA for a higher degree of reliability over conventional column grid arrays and this technology was licensed to STI Electronics, Inc. for its commercialization and production capability.
The Micro-Coil Spring Array is a drop-in replacement for BGA column grid array packaging applications that require greater reliability and long-term robustness. Additionally, it is competitively priced to be lower than column grid array solder columns. Production assembly costs also are lower than for manufacturing the column grid array package.
Since 1982, STI Electronics, Inc. (STI) has been the premier full service organization for training, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly in the electronics industry. STI also produces a complete line of solder training kits and training support products. Additionally, the company distributes products for the electronics and industrial markets.
