SMT, PCB Electronics Industry News

IPC Sponsors International Academiv Paper Competition

Oct 03, 2011

IPC - Association Connecting Electronics Industries®  invites accredited U.S. and international colleges and universities with a strong focus on the electronics industry to submit paper abstracts for IPC’s International Academic Paper Competition. The authors of the top three papers will be invited to present their research at a special session at IPC APEX EXPO®, the industry’s premier conference on electronics manufacturing, February 28-March 1, 2012, in San Diego.

IPC’s International Academic Paper Competition presents academic research departments with an exceptional opportunity to gain international visibility and recognition of their research as well as their academic institution. Notably, this competition at IPC APEX EXPO offers a unique opportunity for close interaction and communication between academic research programs and companies in electronics assembly and printed board manufacturing and design.

Paper submissions are sought on design, materials, processes and equipment in the areas or related areas of:

  • Advanced Technology
  • Area Array/Flip Chip/0201
  • Assembly Processes
  • BGA Packaging
  • Black Pad
  • Business & Supply Chain Issues
  • Counterfeit Electronics
  • Design
  • Electromigration
  • Electronics Manufacturing Services
  • Embedded Passive & Active Devices
  • Environmental Compliance
  • Factory Automation
  • Flexible Circuitry
  • HDI Technologies
  • High Speed, High Frequency & Signal Integrity
  • Lead-Free Fabrication, Assembly & Reliability
  • Microminiaturization
  • Nanotechnology
  • Optoelectronics
  • Packaging & Components
  • PCB Fabrication

Abstracts of 100 to 300 words that summarize technical and previously unpublished, noncommercial work covering case histories, research and discoveries must be submitted by one researcher on behalf of an accredited college or university, and must be received by December 15, 2011.

Abstracts will be judged by an IPC blue ribbon committee and the top three papers will be selected. IPC will provide the primary author/researcher of each of the top three papers with airfare allowance to present his/her paper at IPC APEX EXPO, complimentary hotel accommodations and technical conference registration at no charge.

Past participants of the IPC international academic competition have included: Auburn University; California Polytechnic State University; Johns Hopkins University; Missouri University of Science and Technology; National University, Ukraine; Osaka University, Japan; Purdue University; State University of New York at Binghamton; University of Alaska Fairbanks; University of Applied Science, Germany; University of California – Irvine; University of Delaware; University of Maryland; Waseda University, Japan; Warsaw University of Technology, Poland; and Yuan-Ze University, Taiwan.

For complete details, visit www.IPCAPEXEXPO.org/academic. Questions may be directed to Greg Munie, conference director, at GregMunie@ipc.org or Toya Richardson, IPC technical programs coordinator, at ToyaRichardson@ipc.org or +1 847-597-2825.


IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,000 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.85 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.

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