Dec 14, 2011 
Implementing Lead-Free Soldering with Cost Reduction AND Reliability
Nihon Superior, a supplier of advanced soldering materials to the global market, will showcase a new and expanded range of products based on its SN100C® silver-free, lead-free solder in booth East 30-13 at the upcoming Internepcon Japan exhibition, scheduled to take place January 18-20, 2012 at the Tokyo Big Sight. SN100C now has a track record of more than 12 years of successful delivery of high productivity and high reliability.
Nihon Superior also will present the first of its new SN100C Advantage Series®, SN99CN, which builds on the strengths of the Sn-Cu-Ni formulation of SN100C with a controlled addition of silver. Also on display, Nihon Superior’s second generation range of completely halogen-free solder paste, flux-cored solder wire and liquid flux with no deliberate additions of any halogen (F, C, Br or I) while still delivering excellent wetting on all common substrates.
Where halogen activation is acceptable, the new SN100C (551CT) flux-cored wire provides a new level of performance with a reduced incidence of icicles in sequential soldering and rework. In response to the need to change from copper-to-copper to copper-to-aluminum and aluminum-to-aluminum connections, Nihon Superior is developing a range of alloys and fluxes for both soldering and brazing, and examples of the successful application of these materials will be displayed.
Highlights at the Nihon Superior booth include:
SN100C Advantage Series® Lead-Free Solder Sphere SN99CN and Paste SN99CN P502 D4 SN100C(551CT)
SN99CN, with a controlled addition of Ag is the first of the SN100C Advantage Series®. In high speed pull testing of joints on copper its ranking in relation to other common alloys in terms of fracture energy is SN99CN>SN100C≥Sn-37Pb>Sn-3.0Ag-0.5Cu. While including Ag the SN99CN retains the advantages of SN100C (Sn-0.7Cu-0.05Ni+Ge) including a slow-growing Ni-stabilized intermetallic layer.
High Performance SN100C(551CT) Flux-Cored Solder Wire
With sustained activity and good separation of the solder from the tip with a consequent reduced incidence of icicles, high reliability SN100C (551CT) is ideal for sequential soldering and rework.
2nd Generation Completely Halogen-Free SN100C P602 D4 Solder Paste
Completely halogen-free lead-free solder paste (no intentionally added F, Cl, Br, or I) with high activity for good wetting of terminations and reduced mid-chip balling resulting in excellent solderability while delivering the superior reliability of SN100C (Sn-0.7Cu-0.05Ni+Ge). It can usually be reflowed with a profile similar to that commonly used with SAC305 and SAC405 with a 240C
2nd Generation Completely Halogen-Free NS-F900 Soldering Flux
NS-F900 is a robust halogen-free wave soldering flux that ensures excellent wetting of lead-free solder even on oxidized copper. While being completely halogen-free, (no intentionally added halogens, F, Cl, Br or I), it delivers excellent barrel fill and facilitates drainage as the joints exit the wave to minimize bridging.
Joining Aluminum
Over the past two years aluminum has had a two thirds advantage over copper in price, is a third the density and is highly corrosion resistant so has great potential for replacing it in HVAC, heatsinks, heat pipes and motor windings. Nihon Superior is supporting this change by exhibiting examples of joining of Cu to Al and Al to Al with brazing alloy and lead-free solder using a special flux.
Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products, Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries, and the United States, and formed business partnerships with companies in other markets.
