Jan 23, 2012 
MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, SPI, X-ray and LED inspection systems at the IPC APEX Expo in booth #3637. The three-day event is scheduled to take place February 28-March 1, 2012 at the San Diego Convention Center in California.
“We at MIRTEC are very excited to present our award-winning MV-7xi 2D/3D In-Line AOI Machine at the 2012 IPC APEX Expo,” stated Brian D’Amico, President of MIRTEC Corp. “This technologically advanced system combines MIRTEC’s exclusive 15 Mega Pixel 2D ISIS Vision System with our revolutionary 3D Multi-Frequency Quad Moiré Technology, providing an unsurpassed level of inspection capability to the electronics manufacturing industry.” Fully configured, the new MIRTEC MV-7 machines also will feature four 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel Top-Down Camera.
MIRTEC also will exhibit an MV-7xi In-Line AOI System configured with one Top-Down View Ten Mega Pixel camera with a Precision 13.4 Micron Telecentric Compound Lens and four (4) Ten Mega Pixel Side-View Cameras. The MV-7xi features a 2D camera bar code reader, a high-throughput, three-stage PCB conveyor and a PCB under board support system. The system also will be configured with MIRTEC’s exclusive Intelli-Scan Laser System providing superior lifted lead detection for gull wing devices, four-point height measurement capability for co-planarity testing of BGA and CSP devices, and enhanced solder paste measurement capability.
The MIRTEC MS-11 In-Line SPI System uses Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste deposition on PCBs post screen print. The MS-11 will inspect for; insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. New at IPC APEX 2012, the MS-11 will be configured with the 15M pixel ISIS Vision System for enhanced image quality, superior accuracy and lightening fast inspection rates. The MS-11 uses the same robust platform as MIRTEC’s MV-7 Series. Inspection heads are interchangeable between the two systems, adding ultimate flexibility to the inspection process.
MIRTEC’s MV-7XP LED Inspection System was developed to specifically address the inspection requirements of the LED manufacturing industry. This specialized system uses MIRTEC’s exclusive 15 Mega Pixel ISIS vision system configured with a super high resolution 5 micron Precision Telecentric Compound lens and a high brightness blue LED lighting system to perform bond wire, chip die and stitch ball inspection.
MIRTEC’s MV-7UP LED Inspection System uses MIRTEC’s exclusive 2D/3D technology for the inspection of LED packages after the encapsulation portion of the LED manufacturing process where an epoxy lens is formed to seal and support the electronic components. The MV-7UP uses 2D inspection to detect foreign materials and bubbles within the epoxy. 3D inspection is used to provide a volumetric measurement of the epoxy encapsulant.
The MIRTEC MV-3L Desktop AOI System is the industry’s most widely accepted five camera desktop AOI system. The system is configured with one Top-Down View Ten Mega Pixel camera with a Precision 13.4 Micron Telecentric Compound Lens and four (4) Ten Mega Pixel Side-View Cameras. It also features the Intelli-Beam Laser System. This advanced technology provides: four-point height measurement capability for co-planarity testing of BGA and CSP devices as well as enhanced solder paste measurement capability.
MIRTEC’s new MV-2GT Desktop AOI System was developed to provide “World Class” MIRTEC Advanced Technology to the electronics manufacturing industry at an affordable price. The system is based on MIRTEC’s award-winning MV-2 Desktop AOI Series with an installed base of several thousand machines still in operation today! Backed by MIRTEC’s industry acclaimed global support organization, the newly redesigned MV-2GT is configured with a single Top-Down 5 Mega Pixel Digital Color Camera System, Auto Clamp PCB Workholder and a three stage LED Lighting System. The system offers superior fault coverage and will detect defects such as component presence/absence, polarity, miss alignment, insufficient solder, solder bridging, etc. The system software is very powerful, yet extremely simple to use. The standard SPC software package promotes continuous process improvement by allowing the user to track and eliminate defects on inspected assemblies.
The 6000-CT X-Ray Inspection System is a highly flexible, state-of-the-Art X-ray solution for the electronics manufacturing industry. The 6000-CT may be configured with either a 130KV 3 micron, or a 100KV 4 micron closed loop X-ray tube, providing high power for added sample penetration and the ability to image defects down to 1 micron in size. The system provides 360° rotation and +/- 70 degree camera tilt for oblique extreme sample inspection from an infinite number of angles. This, combined with an extremely generous 20 x 24" inspection stage and an incredible 1000X system magnification, makes the 6000-CT one of the industries most flexible X-Ray inspection solutions. The 6000-CT also may be upgraded for Computed Tomography (CT), allowing for true 3D inspection of PCB components for internal defects. The system is very easy to operate and provides simple program generation for automatic inspection of desired inspection areas.
At the booth, visitors can learn more about MIRTEC’s total quality management system software, Intellisys. The software suite promotes continuous process improvement by allowing manufacturers to track and eliminate defects on inspected assemblies.
“MIRTEC has earned a solid reputation in the industry by providing unprecedented performance, quality and cost-effectiveness to the inspection environment,” continued D’Amico. “We look forward to welcoming visitors to our booth #3637 during the three-day event.”
MIRTEC is a leading global supplier of automated inspection systems to the electronics manufacturing industry. For further information, please visit www.mirtecusa.com.
