Mar 30, 2012 
The Pilot V8 is an innovative technology that offers maximum performance in regards to high test speed, test coverage and flexibility. The system’s vertical architecture is the optimum solution for probing both sides of the UUT simultaneously. This feature guarantees fast, precise, reliable and repeatable probing; it also allows for full availability of all the mobile resources for testing the UUT.
The Pilot V8 is equipped with 8 electrical flying test probes (4 on each side), 2 Openfix flying probes (1 on each side),2 CCD cameras (1 on each side), and 2 power probes (1 on each side) for a total of 14 mobile resources available to test the UUT. The mobile power probes enable power up of the UUT without requiring any additional fixed cables, allowing easy implementation of functional test.
The test tools and techniques of the Pilot V8 include:
FNODE signature analysis on the nets of the UUT
Standard analog and digital in-circuit test
Vector-less tests (AUTIC and OPENFIX), to test ICs for opens and shorts
PWMON net analysis for power on the boards
Continuity test to detect open tracks on the PCB
Visual tests for component presence/absence and rotation
Optional functional test and boundary scan test capabilities
On Board Programming tools for digital devices
Optional Thermal Scan resources
Firefly
The Firefly Selective Soldering system is a laser-based technology, developed with complete automation and simplicity of use in mind. The Firefly has been designed to optimize flexibility and automation, including solutions for specific requirements, such as an external pre-heating unit. The Firefly is available in three configurations: top soldering, bottom soldering, along with top and bottom soldering.
The laser in the Firefly system is a clean and versatile technology. The energy through the laser allows for point to point adjustment of the power needed for soldering; the lack of thermal inertia of the laser, combined with real-time temperature readings, enable the dynamic creation of the thermal profile. The ability to apply all of the energy in a single point makes this technology applicable in situations where it is not possible to heat the whole board or where there are problems generated by reduced accessibility. The user is able to change from lead to lead-free solder by simply changing the spool of solder wire. The clean soldering process eliminates the costs and logistics involved with cleaning boards and handling residual waste.
Compact TK, shown at SMT Nuremberg with an automotive solution/adaption
The Compact TK is the smallest configuration of the Functional and In-Circuit systems. Voted best in World Class Manufacturing by a premier Automotive contract manufacturer, the Compact line is recommended for ICT, functional, and on-board programming applications. It is characterized by a high level of ergonomics, small footprint, easy maintenance, low power consumption and enhanced operator safety. The features of the Compact TK include:
Small stand-alone solution
Parallel test option
Up to 1536 analog channels
Up to 128 hybrid channels (maximum 10 MHz digital)
Up to 6 user power supplies
Functional test expandability
On board programming features
Boundary scan test option
Pneumatic/vacuum fixture receiver included
Cabinet fully integrated with PC and receiver
About Seica:
Seica S.p.A, founded in 1986, is a global supplier of automatic test equipment and selective soldering systems, with an installed base of more than 1000 systems on four different continents. Seica offers completely automated, laser-based selective soldering solutions, as well as a complete line of test solutions, which include bed of nails and flying probe testers; these have the ability to perform manufacturing defect analysis, in-circuit tests, functional tests and optical tests of loaded boards, second and third level electronic modules and printed circuit boards. Seica S.p.A corporate headquarters is located in Italy, with offices in France, Germany, USA, and China, along with a worldwide distribution network.
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