Apr 03, 2012 IPC — Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders to submit abstracts for the 2013 IPC APEX EXPO® at the San Diego Convention Center in San Diego, Calif. The technical conference will be held February 19–21, 2013, and the professional development courses will be February 17–18 and February 21, 2013.
The world’s premier conference and exhibition for the electronic interconnect industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. To recognize exceptional achievement, awards will be presented for “Best U.S. Paper” for U.S. authors and the “Best International Paper” for authors from outside the United States.
Expert presentations are being sought on all relevant design, PCB fabrication and electronics manufacturing topics. Submissions dealing with lead-free processing, repair and reliability, high-speed PCB laminates and new research in growing areas such as green technology and printed electronics are especially encouraged. A 300-word abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted by May 4, 2012. The submission should describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain a summary of technical and/or appropriate test results.
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