Jul 25, 2012 
The Balver Zinn Group announces that Cobar BV’s Gerjan Diepstraten will present a paper titled “Reflow Soldering Equals Wave Soldering Plus One” at the upcoming IPC Midwest Exhibition & Conference, scheduled to take place August 22-23, 2012 at the Renaissance Schaumburg Convention Center Hotel in Schaumburg, IL. The presentation will be held during Session S05 titled “Assembly Process Soldering Materials,” which will take place Thursday, August 23, 2012 from 10:15 - 11:45 a.m.
Five years after the implementation of lead-free solder there is still a discussion about which alloy is best for which application. Alternative lead-free solders are available with doping of small amounts of elements to improve reliability. This study compares the SAC305 solder with new generation lead-free alloys.
A design of experiment was performed to define the process window of the different alloys. Do process parameters such as flux selection, preheat settings or solder temperature have an impact on solder ability, hole filling, tensile strength, intermetallic thickness or shear forces of the solder joints? The test boards included different pad and barrel dimensions. This returns recommendations for designers to define the optimal pin-to-hole ratio for the different alloys.
Does reflow soldering require the same alloy as wave soldering? The final conclusion from this study is that there might be a correlation with the SnPb period. Reflow soldering equals wave soldering plus one. The presentation will explain this in detail.
The Balver Zinn/Cobar Group has sales offices in Germany, Netherlands, USA, Singapore and distributors in all major areas of the world.
For more information visit: www.cobar.com.
