SMT, PCB Electronics Industry News

Pennsylvania State University Wins Finetech Die Bonder Donation

Aug 29, 2012

Pennsylvania State University was selected in a university donation drawing for a FINEPLACER® Pico MA bonder on August 15, 2012. The multi-application system with 5 micron placement accuracy is valued at $100,000. As part of its 20th anniversary celebration this year, Finetech chose to give back to the university R&D segment of its business by donating a bonder for research and education.  Nearly 400 entries were received, representing 95 universities.

International Microelectronics and Packaging Society (IMAPS) President Voya Markovich visited the Finetech office in New Hampshire to select the winning university in a random drawing. IMAPS also shares a close relationship with academic researchers through its Microelectronic Foundation. This group supports students and research with activities that promote an understanding of how components are made as well as related assembly technologies and materials.

We are delighted to be chosen for the die bonder donation and look forward to using it in our new lab for research dealing with heterogeneous integration of materials and MEMS packaging applications. I have always wanted a die bonder to complete my packaging lab, but funding was always the challenge,” states Srinivas Tadigadapa, Pennsylvania State University, Professor, College of Engineering - MEMS Nanoscale and Devices Group.

With a wide installed base of systems at many prestigious institutions, FINEPLACER® die bonders provide an ideal solution for advanced technology environments utilizing diverse applications. The FINEPLACER® Pico MA is an “all-in-one” platform for precise packaging and assembly applications -- such as flip chip, optoelectronics, 3D, wafer level integration, micro-optics assembly, sensor packaging and precise die bonding.

For more information about the university donation drawing and Finetech, visit http://www.finetechusa.com/bonders/products/promotion.html.

For more information about the MEMS Nanoscale and Devices Group http://mnd.ee.psu.edu/index.asp.


 Finetech is a leading manufacturer of equipment for manual and fully automatic component rework and high-precision bonding and die attach. The company services customers in a broad range of industries including aerospace, medical technology, consumer electronics, semiconductor, optoelectronics, military, universities and research.  Finetech offers a flexible approach to customer support and welcomes the opportunity to create customized, effective solutions.  Corporate headquarters and main production are in Berlin, Germany.  Sales and Technical support centers are located in Tempe, Arizona; Manchester, New Hampshire; Shanghai, China and Kuala Lumpur, Malaysia.


Pennsylvania State University – MEMS Nanoscale and Devices Group.
The Pennsylvania State Electrical Engineering Department, established in 1893, is among the largest, oldest, and most innovative in the nation.  The main focus of the department’s Micro & Nanoscale Devices Group is to design, model, and fabricate devices using MEMS fabrication technologies for transducer applications and investigation of interfacial science at the nanoscale. Research areas include:  materials and devices for electronic, photonic, bioelectronic and MEMS applications, amorphous and crystalline silicon, III-V compounds, organic thin films, ferroelectric and piezo-electric; development of novel device structures and manufacturing methods, device and circuit simulation and modeling, device and material characterization


 

Jan 14, 2019 -

Finetech to Demo Contactless Residual Solder Removal at IPC APEX 2019

Apr 07, 2016 -

Finetech/Martin Introducing New Rework and Dispense Solutions at IPC APEX 2016

Nov 27, 2013 -

Martin Streamlines and Simplifies Rework with New Process Shuttle

Nov 08, 2013 -

Finetech Unveils High Force ACF Bonder

May 28, 2013 -

Al Cabral Joins Finetech as Regional Sales Manager

Mar 11, 2013 -

Donated Finetech Die Bonder Installed at Pennsylvania State University

Jan 16, 2013 -

Finetech to Exhibit the Ideal Blend of Performance and Cost Rework Technology at the 2013 IPC APEX EXPO

Jan 04, 2013 -

Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West

Oct 03, 2012 -

The Best in Rework Technology – Finetech to Exhibit FINEPLACER® Core Rework System at SMTA International

Sep 26, 2012 -

MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show

77 more news from Finetech »

Jan 25, 2022 -

Gen3 Systems announces product line up for Southern Manufacturing 2022

Jan 24, 2022 -

Circuit Technology Center Partners with Hentec RPS to Provide World-Class Component Modification Services

Jan 23, 2022 -

ViTrox Unveils Its New V810i S3 AXI System at IPC APEX Expo 2022

Jan 23, 2022 -

Permalex Squeegees Selected by Henkel/Aqua Membranes for Advanced RO Filter Technology

Jan 23, 2022 -

SVTronics Makes KYZEN Its Cleaning Chemistry Standard

Jan 23, 2022 -

Fastest Growing SMT Manufacturer in the US Exhibits at APEX 2022.

Jan 23, 2022 -

Join CWIEME and Specialty Coating Systems for a free Tech Talk in February!

Jan 23, 2022 -

Weller's unique ventilation concept extraction cabinet provides ultimate flexibility

Jan 23, 2022 -

CyberOptics Unveils New Dual-mode MRS™ Sensor for Solder Paste Inspection at IPC APEX 2022

Jan 23, 2022 -

Southwest Systems Technology starts the New Year with two new Account Managers

See electronics manufacturing industry news »

Pennsylvania State University Wins Finetech Die Bonder Donation news release has been viewed 663 times

 Reflow System

Fluid Dispensers