Sep 13, 2012 
MIRTEC, “The Global Leader in Inspection Technology”, announced that it will premier its Technologically Advanced AOI Equipment at SMTAI Orlando 2012, which will take place October 16-17, 2012 at the Walt Disney World Dolphin Hotel, Orlando, Florida.
“We at MIRTEC are very excited to present our award-winning MV-9 2D/3D In-Line AOI Machine at SMTAI Orlando 2012,” stated Brian D’Amico, President of MIRTEC Corp. “There is little doubt that this new technology will set the standard by which all other inspection equipment will be measured.”
The MV-9 2D/3D AOI System is configured with MIRTEC’s revolutionary OMNI-VISION® 3D Inspection Technology which combines 15 Mega Pixel 2D Inspection with advanced Digital Multi-Frequency Moiré 3D inspection to provide precision inspection of SMT devices on finished PCB assemblies. The system is configured with a state-of-the-art 15 Mega Pixel ISIS Vision System. ISIS is an acronym for Infinitely Scalable Imaging Sensor. As the name implies the ISIS Vision System may be scaled or modified to address the specific inspection requirements of virtually any production environment without sacrificing speed or performance. MIRTEC’s Technologically Advanced Six Phase Lighting System uses multi color LEDs to illuminate inspection areas from six different angles providing superior solder joint characterization and co-planarity inspection of leads on gull-wing devices. MIRTEC’s revolutionary Digital Multi Frequency Quad Moiré Technology, provides true 3D inspection of SMT devices on finished PCB assemblies using a total of four (4) Moiré Inspection Probes. This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured the new MIRTEC MV-9 machines will also feature four 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel Top-Down Camera.
MIRTEC will also feature their award winning MV-3L Desktop AOI System configured with their exclusive 10 Mega Pixel ISIS Vision System. This revolutionary optics system is comprised of a 10 Mega Pixel Top Down camera and a Precision 13.4 Micron Telecentric Compound Lens. MIRTEC’s patented “Quad Angle Lighting System” provides four independently programmable zones for optimal illumination of inspection areas. The MV-3L will also be configured with Four (4) Ten Mega Pixel Side-View Cameras as well as MIRTEC’s exclusive Intelli-Beam Laser System. This advanced technology provides: Four-point height measurement capability for co-planarity testing of BGA and CSP devices as well as enhanced solder paste measurement capability in a cost effective desktop AOI system. The MV-3L is powerful yet simple to use. A comprehensive Package Type Library provides simple “Drag and Drop” component programming. The Automatic Teaching Tool (ATT) software provides automatic teaching of component locations using CAD centroid data.
“MIRTEC has earned a solid reputation in the industry by providing unprecedented performance, quality and cost-effectiveness to the inspection environment”, continued D’Amico, “We look forward to welcoming visitors to our booth #500 during the two day event.”
MIRTEC is a leading global supplier of Automated Optical Inspection Systems to the Electronics Manufacturing Industry. For further information please visit our website at www.mirtecusa.com
