Feb 12, 2001 Ultrasonic Systems, Inc. (USI), introduces the EZ-Flux automatic spray fluxing system for economical application of flux to printed circuit boards. EZ-Flux utilizes spray nozzle technology with two-direction spray. An air-actuated traversing mechanism provides precise motion control at a speed of 10-15 inches per second. A rugged system design maintains deposition variation of +/- 15%. Combining automatic application and low capital cost, EZ-Flux is ideal for low to medium volume assembly requirements.
The EZ-Flux spray head delivers flux through a pressurized delivery system with a deposition range of 500-3000 g/in. A dual nozzle option is available, allowing the operator to switch flux types as required by different processes in less than one minute. The system can be upgraded to include Ultra-Spray technology, which features a vibrating solid titanium head and powerful air jets that create a highly repeatable spray coating.
EZ Flux accommodates all liquid fluxes, including no-clean, O/A, and RMA fluxes. Standard board width capacity is 1"-20", with the option of expanding to 24" capacity. EZ-Flux can be installed internally or externally to a wave soldering system, or in a stand-alone unit. Like all USI systems, EZ-Flux is backed by the USI staff of applications engineers and customer support staff.
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