Oct 17, 2012 
Nihon Superior Co., Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it was awarded a 2012 Global Technology Award in the category of Materials – Solder Paste for its SN100C P810 D4 No-Clean Lead-Free Solder Paste. The award was presented to the company during a Tuesday, October 16, 2012 ceremony that took place at the Walt Disney World Dolphin Hotel in Orlando, FL during SMTA International 2012.
SN100C P810 D4 is high reliability lead-free solder paste designed especially for reduction of voids in large-area solder joints such as those between power semiconductors and their substrates. Voiding is reduced even further with vacuum reflow. SN100C P810 D4 is based on the SN100C alloy that has enjoyed more than a decade of success and innovation providing superior solutions in numerous applications
Premiering in 2005, the Global Technology Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts
Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products, Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries, and the United States, and formed business partnerships with companies in other markets.
