Feb 25, 2013 
In order to meet growing demands for advanced solder paste applications, MYDATA has recently completed successful testing of a new low-temperature solder paste for jet printing. The test results, to be presented in a seminar at APEX in San Diego on February 19th, will come as welcome news for manufacturers of consumer electronics, says Veronica Wänman, Product Manager at MYDATA.
At a seminar at Apex 2013, global SMT equipment manufacturer MYDATA will reveal new opportunities for faster, more accurate application of low-temperature solder paste. Part of an ongoing effort to lead innovation in solder paste application in high-volume SMT manufacturing, the seminar will focus on the successful results of a newly developed solder paste for the MY500 Jet Printer.
Low-temperature soldering allows SMT manufacturers to mount increasingly challenging and temperaturesensitive components without risking damage due to multiple reflow. According to Wänman, “MYDATA has now made this process faster than ever, since jet printing is proven to be the fastest way to apply paste to populated boards.” Common challenges such as repair and shield mounting can therefore be overcome at the speeds demanded by high-volume manufacturers, while at the same time eliminating less efficient processes such as wave soldering and traditional dispensing, she adds.
The new low-temperature solder paste (ALPHA JP-501) has been developed in collaboration with Alpha, a leading global electronic assembly materials supplier. Its addition further expands the capabilities of the company’s versatile MY500 Jet Printer, which is designed to enable manufacturers to mount all types of increasingly complex components with solder joints of the highest possible quality.
The APEX seminar, entitled Jet Printing of Low-temperature Solder Paste, will be conducted by Gustaf Mårtensson, resident innovation field expert and Associate Professor at Chalmers University of Technology in Sweden. In addition to the MYDATA presentation, Alpha will present two papers on Low Temperature SMT processing. The seminar will be held on Tuesday, February 19th, at 1:30 pm in S05 at IPC APEX Expo 2013.
For more information on MYDATA’s MY500, please stop by Booth Number 2639. For more information on Alpha’s suite of Low Temperature pastes, please stop by Booth Number 3227.
For more information, please contact:
Simon Sandgren, Marketing Director Tom Hunsinger, Global Product Manager
Micronic Mydata AB Alpha
PO Box 3141, SE-183 03 Täby, Sweden 109 Corporate Boulevard Tel: +46-8-638 52 00 South Plainfield, NJ 07080, USA Fax: +46-8-638 52 90 Phone: +1-908-791-3000 info@mydata.com Email:thunsinger@alent.com
www.mydata.com www.alpha.alent.com
