SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • BTU International announcing that it joined the Advanced Research in Electronics Assembly (A.R.E.A.) Consortium

BTU International announcing that it joined the Advanced Research in Electronics Assembly (A.R.E.A.) Consortium

Oct 15, 2013

BTU International, Inc. today announced that it joined the Advanced Research in Electronics Assembly (A.R.E.A.) Consortium, established by Universal Instruments’ Advanced Process Laboratory. In addition, BTU installed a PYRAMAX™ 100N Reflow Oven with 400°C capability in the state of the art Advanced Process Laboratory (APL).

The A.R.E.A Consortium consists of more than 30 members representing leading companies in the electronics assembly industry. The Consortium aims to develop a fundamental, mechanistic understanding of the materials and processes utilized in electronics assembly, with special focus on maximizing assembly yields and long-term reliability. A team of experienced scientists conducts fast-paced research and reports back results at quarterly meetings. All research is conducted in the APL and takes advantage of the lab’s comprehensive production and analytical equipment set.

BTU’s ovens and furnaces have long been recognized as performance leaders providing our customers with the utmost in process control.  This oven will be used to develop leading-edge processes for semiconductor packaging, high temperature related studies and electronics assembly,” said Rob DiMatteo, BTU’s eastern regional sales manager. 

Furthermore our involvement in this consortium extends our ability to partner with customers for process development, it’s a win-win,” added DiMatteo. 

BTU’s PYRAMAX™ family of high-throughput thermal processing systems is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. PYRAMAX™ systems provide optimized lead-free processing for the ultimate in productivity and efficiency. BTU’s exclusive closed loop convection control provides precise heating and cooling, programmable heat transfer, and reduced nitrogen consumption, adding up to the lowest Cost of Ownership in the industry. 


BTU International is global supplier and technology leader of advanced thermal processing equipment and processes to the electronics and alternative energy manufacturing markets. BTU equipment is used in the production of printed circuit board assemblies and semiconductor packaging as well as in solar cell and nuclear fuel manufacturing. BTU has operations in North Billerica, Massachusetts and Shanghai, China with direct sales and service in the USA, Asia and Europe.

Information about BTU International is available at www.btu.com.

Mar 26, 2024 -

BTU International Redefines Operational Value and Efficiency with the Aurora Platform of Reflow Ovens

Mar 18, 2024 -

BTU's Aurora Scores Another Award – 2024 NPI Award Recipient

Mar 11, 2024 -

Key Highlights: Enhanced Modularity for Seamless Integration: CalcuQuote is proud to announce the evolution of its products to offer enhanced modularity. This strategic move ensures that all features

Mar 11, 2024 -

Key Highlights: Enhanced Modularity for Seamless Integration: CalcuQuote is proud to announce the evolution of its products to offer enhanced modularity. This strategic move ensures that all features

Mar 11, 2024 -

Key Highlights: Enhanced Modularity for Seamless Integration: CalcuQuote is proud to announce the evolution of its products to offer enhanced modularity. This strategic move ensures that all features

Nov 20, 2023 -

BTU International Surpasses 50 Awards with 2023 GLOBAL Tech Award Win

Nov 06, 2023 -

BTU Supports Fastest Line Speeds with New Aurora 200N

Oct 31, 2023 -

BTU International Receives Double Honors with Two 2023 Mexico Technology Awards

Oct 02, 2023 -

BTU International to Highlight Advanced Process Control at SMTA Space Coast Expo

Sep 25, 2023 -

BTU International Partners with SMarTsol to Showcase Locally Built Pyramax Reflow Oven at SMTA Guadalajara Expo

318 more news from BTU International »

Apr 30, 2024 -

Koh Young Extends Invitation to the 2024 IEEE Electronic Components and Technology Conference in Denver, Colorado Opening May 28, 2024

Apr 29, 2024 -

New! Model ZM-R750 PC Controlled BGA Rework Station.

Apr 29, 2024 -

RAY TECH (MALAYSIA), UNICOMP Technology's first overseas production base officially in operation to follow Belt and Road Initiative

Apr 29, 2024 -

Aven Launches the Cyclops 4K Ultra HD Digital Microscope: Redefining Precision Viewing

Apr 29, 2024 -

SMTA Long Island Chapter Celebrates 30th Anniversary with Membership Appreciation Event

Apr 29, 2024 -

KYZEN Announces Exclusive Partnership with Manufacturers' Representative Restronics Florida

Apr 29, 2024 -

KYZEN to Promote Pair of Stencil Cleaning Chemistries at SMTA Ciudad Jaurez Expo & Tech Forum

Apr 29, 2024 -

SMTXTRA Partners with Quantum Systems to Expand Representation in Key Territories

Apr 29, 2024 -

SHENMAO Debuts Special Solder Paste for AI Substrate Power Management Modules

Apr 29, 2024 -

SMTXTRA Partners with Quantum Systems to Expand Representation in Key Territories

See electronics manufacturing industry news »

BTU International announcing that it joined the Advanced Research in Electronics Assembly (A.R.E.A.) Consortium news release has been viewed 871 times

  • SMTnet
  • »
  • Industry News
  • »
  • BTU International announcing that it joined the Advanced Research in Electronics Assembly (A.R.E.A.) Consortium
High Throughput Reflow Oven
High Precision Fluid Dispensers
Reflow Oven

convection smt reflow ovens