Feb 21, 2014 
Metcal today announced that Paul Wood will present “Rework Challenges for Smart Phone & Tablets: Do it Right the First Time” during the Rework technical session at IPC APEX EXPO on Wednesday, March 26, 2014 from 1:30-3 p.m. at the Mandalay Bay Convention Center in Las Vegas, NV.
The technical session will cover rework of electronics assemblies, addressing challenges related to rework of smart phones and tablets including removal and replacement of PoP (package-on-package), and fine pitch BGA components.
After attending this rework technical session, users will understand the challenges and processes required to achieve successful repair of the complex boards and components found in smart phones and tablets. The removal techniques of various packages as well as the cleaning methods of underfills, glue from substrate and solder pads, will be explained. Package on Package (PoP), BGA/CSP rework and general ultra-fine pitch BGA style component removal and replacement will also be understood. Finally, how and why the reclaim of expensive components can be a worthwhile endeavour when they are carefully removed.
Mr. Wood will be joined by two other presenters: Jasbir Bath, Principal Engineer, IPC and Robert Wettermann, Engineer, BEST Inc.
For more information or to register, please visit www.ipcapexexpo.com.
Since 1982, Metcal has been a recognized worldwide leader in the electronics assembly marketplace. As part of OK International, Metcal’s industry-leading position addressing advanced technology in conduction soldering and rework/repair, has and will continue to broaden to a full electronics bench tool single-source solution. Metcal product lines currently include: hand soldering and desoldering, convection rework products, fume extraction and fluid dispensing tools.
For more information, visit www.metcal.com.
