SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • World’s First SMT Assembler with Integrated Solder Paste Jet Printer from Essemtec Recognized by NPI Awards

World’s First SMT Assembler with Integrated Solder Paste Jet Printer from Essemtec Recognized by NPI Awards

Mar 26, 2014

Paraquda

Paraquda

Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, announces that it has been awarded a 2014 NPI Award in the category of Component Placement – Multi-function for its multi-functional SMT Center. The award was presented to the company during a Tuesday, March 25, 2014 ceremony that took place at the Mandalay Bay Convention Center during the IPC APEX EXPO. Essemtec is the first manufacturer that developed a combined SMT production center that is able to jet solder paste and mount components in one machine.

The multi-functional SMT center Paraquda meets all the requirements of a modern, highly flexible production system - changeover without downtime, component management, and the integration of jet printing of solder paste or glue. Paraquda combines two different production steps within one machine platform (solder paste jetting and SMD assembly). With this unique combination, the multifunctional center allows an unprecedented flexibility in the market.

Essemtec’s solder jet printer is fast (up to 80,000 dots/hr), very precise (51µm @3σ) and suitable for 0201 components. So far, jetting of solder pastes was possible only with limitations – electronics manufacturers needed to buy specially designed, costly solder pastes. The new system from Essemtec opens the range of pastes to most type 4, 5, 6 or 7 pastes. Essemtec’s solder paste jet valve can be installed on existing machines platforms, such as the Scorpion high-speed jet dispenser or the Paraquda component placer.  Production is fully automated, and solder paste application and component placement are seamlessly integrated while process monitoring ensures high-quality results.

Premiering in 2008, the NPI Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.

For more information about Essemtec's SMT production center, visit www.essemtec.com.


The Swiss equipment manufacturer Essemtec is the global innovation leader for flexible production systems for electronic assembly and packaging. Essemtec has been developing, manufacturing and marketing equipment for all processes in the electronics industry since 1991: such as printers, jet dispensers, pick-and-place and soldering systems. Manual, semiautomatic and fully automatic systems are available. The range of products also includes transportation and storage systems, as well as software solutions for planning, simulation optimization and documentation of manufacturing. All Essemtec systems are optimized for maximum flexibility. Users can switch from one product to another quickly, making maximum use of available production capacity.
Essemtec - Be more flexible.

Sep 30, 2024 -

Essemtec to Showcase Advanced SMT Solutions at SMTAI 2024 Dispensing, Pick-and-Place, Underfill, Reballing & More Solutions

Sep 16, 2024 -

Essemtec Wins 2024 Mexico Technology Award for Excellence in Dispensing Technology

Aug 26, 2024 -

Essemtec Presents All-in-One SMT Solutions of High-Speed Dispensing, Pick-and-Place and Integrated Inspection Systems at SMTA Guadalajara

Jun 10, 2024 -

Essemtec is exhibiting at SMTconnect booth 4.209.

May 20, 2024 -

SMTO ENTERS NEW PARTNERSHIP WITH ESSEMTEC FOR MEXICO

Mar 18, 2024 -

Essemtec is exhibiting at APEX Expo at booth 2409.

Mar 11, 2024 -

Explore Essemtec's Naturally Adaptive Manufacturing Solutions at the SMTA Monterrey Expo

Nov 05, 2021 -

Essemtec Won the 2021 Mexico Technology Innovation Award for Its Solder Paste Jet Dispensing Solution

Nov 05, 2021 -

Nano Dimension Acquires Essemtec AG, Surface-Mount Pick & Place Systems Supplier for the PCB and OEM Industries

Oct 13, 2021 -

Essemtec Will Demo New Multi-Function Solder Paste Jetting Solution at Productronica 2021

216 more news from ESSEMTEC AG »

Nov 18, 2024 -

IPC Celebrates National Apprenticeship Week with a Focus on Electronics Manufacturing Excellence

Nov 18, 2024 -

IPC Introduces First Standard for In-Mold Electronics

Nov 18, 2024 -

Disruptive Innovation and Generative AI Inventor, Kevin Surace, to Keynote IPC APEX EXPO 2025

Nov 18, 2024 -

Etek Europe Expands Partnership with ITW EAE to Represent Despatch Products in the UK and Ireland

Nov 18, 2024 -

Kurtz Ersa Honors Jean Verchere's 30 Years of Dedication as He Retires

Nov 18, 2024 -

KIC Launches Game-Changing TAS Software Platform to Address Emerging Thermal Process Challenges

Nov 18, 2024 -

Nordson Test & Inspection Receives Top Honor with Prime Step-by-Step Innovation Award for SQ3000M2 System

Nov 18, 2024 -

Scienscope's New Xspection 3120 Inspects Long PCBs

Nov 18, 2024 -

PARMI USA, INC. Appoints Juan Arango as Head of Sales and Business Development to Drive U.S. Market Growth

Nov 18, 2024 -

Naprotek Welcomes Aerospace and Defense Veteran to Board of Directors

See electronics manufacturing industry news »

World’s First SMT Assembler with Integrated Solder Paste Jet Printer from Essemtec Recognized by NPI Awards news release has been viewed 1473 times

  • SMTnet
  • »
  • Industry News
  • »
  • World’s First SMT Assembler with Integrated Solder Paste Jet Printer from Essemtec Recognized by NPI Awards
Win Source Online Electronic parts

December 2024 Auction