Apr 03, 2014 
Indium Corporation will feature SACm™ solder paste at NEPCON China April 23-24 in Shanghai, China.
SACm™ is a high-reliability, low-cost solder paste that offers drop test performance far superior to other SAC pastes without compromising on thermal cycling - all at a cost below that of typical SAC solder paste.
SACm™ meets the electronics assembly market’s demand for a solder paste that offers the combination of good drop test performance, good thermal cycling, lead-free composition, and reduced cost.
SACm™ offers superior drop test performance when compared to SAC305 and SAC105, with the added benefit of thermal cycling reliability that is equivalent to SAC305. SACm™ provides manufacturers with an affordable high-reliability SAC solder paste. This new alloy is especially meaningful for the manufacture of consumer electronics that normally see frequent handling, such as mobile devices.
SACm™ is doped with manganese and contains less silver than other Pb-free solder pastes. Manganese provides increased strength and the reduced silver content provides a more stable cost structure, which is especially beneficial for cost-sensitive applications.
Indium Corporation will be exhibiting at booth A2-1F29
For more information about Indium Corporation’s SACm™ solder paste, visit www.indium.com/SACm or email sacm@indium.com
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
