SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • AI Technology, Inc. (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF)

AI Technology, Inc. (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF)

May 07, 2014

AI Technology, Inc. (AIT) has solved one of the technically more challenging problems in wafer level semiconductor packaging to achieve conductive die-attach film adhesive (DAF) of 20 micron thickness. While die-attach film adhesive (DAF) at the wafer level is becoming more prevalent in die-attach for memory modules in precision bonding and thin packages, thermally conductive and electrically conductive die-attach film is more limiting because of the challenging handling and performance issues for the thinner conductive DAF.

AIT’s conductive DAF is built on the same self-supporting die-attach film (DAF) adhesive technology that the company pioneered in the 1990’s.  AIT is now able to produce ESP8660-HK in 20 micron thickness for power devices from microprocessors to concentrated solar die-attach modules.   This new thickness marks an improvement over AIT’s 50 microns thick ESP8660-HF which was first produced in 2005.

ESP866-HF can be produced in wafer-shape die-cut format and pre-laminated on dicing tape (DDAF) format up to widths of 450mm and lengths of 100 meters in AIT’s clean room manufacturing environment housed in the company’s 16 acres facilities in Princeton Junction, NJ.

Not only is ESP8660-HK available in 20 micron thickness, it is also developed for high glass transition requirements to facilitate faster wire-bonding at temperatures as high as 250°C.   ESP8660-HK is also molecularly engineered to reduce stress and ultimately improve the reliability of multi-chip module (MCM) and system in package (SIP) devices.

In addition to achieving one of the lowest thermal resistances with thermal conductivity of over 8 W-m/°K, ESP8660-HK maintains its bond strength after 85%RH/85°C and demonstrates reliability test results after thermal cycling and shock that are not common even for traditional paste die-attach adhesives.


Since pioneering the use of flexible epoxy technology for microelectronic packaging in 1985, AI Technology, Inc. (AIT) has been one of the leading forces in development and patented applications of advanced materials and adhesive solutions for electronic interconnection and packaging.  AI Technology, Inc. (AIT) offers some of the most reliable adhesives and underfills for die bonding for the largest dies, stack-chip packaging with dicing die-attach film (DDAF), flip-chip bonding and underfilling and high temperature die bonding for single and multiple-chip modules for applications beyond 230°C.  The company continues to provide the best adhesive solution for component and substrate bonding for both military and commercial applications. 

AIT’s thermal interface material solutions, including our patented phase-change thermal pads, thermal greases and gels and thermal adhesives have set many bench marks of performance and reliability for power semiconductors, modules, computers and communication electronics. For an application analysis:  www.aitechnology.com/analysis/

Media Contact: Amy Grossman, (609) 799-9388, agrossman@aitechnoloy.com

Aug 17, 2016 -

Temporary Bonding Adhesive for Thin Wafer Handling

Mar 20, 2015 -

AI Technology, Inc (AIT) Introduces 3D-TSV Ultra-Thin Wafer Processing Temporary Bonding Adhesive Film

Nov 07, 2014 -

AI Technology, Inc (AIT) To Attend and Present Paper at IWLPC. AIT also attending IPC/SMTA High-Reliability Cleaning and Conformal Coating Conference.

Oct 14, 2014 -

AI Technology, Inc (AIT) Develops Conformal Coatings to Protect Electronics in Extreme Environments

Sep 05, 2014 -

AI Technology, Inc (AIT) Develops Temporary Bonding Wax for Precision Wafer and Substrate Back-grinding and Thinning Applications

Jul 28, 2014 -

AI Technology (AIT) Introduces Novel High Temperature Large Area Underfill with Proven Stress Absorption

Jun 05, 2014 -

AI Technology, Inc. (AIT) Releases Cool-Gumpad™ (Thermal Interface Pad) CGP7156

Apr 10, 2014 -

AI Technology, Inc. (AIT) Increases Manufacturing Capacity of Advanced 10 Micron Wafer Level Die-Attach Film (DAF)

Mar 20, 2014 -

AI Technology, Inc. (AIT) Releases COOL-PAD™ CPR (Conformal Pad) 7154: Second Generation (US Patent 6,496,373).

Mar 27, 2024 -

Red Glue SMT Solutions: A Cost-Effective Approach for Double-Sided PCBs

Mar 26, 2024 -

North American PCB Industry Sales Down 11.6 Percent in February

Mar 26, 2024 -

iNEMI/IPC White Paper on Complex Integrated Systems Highlights Future Technology and Manufacturing Ecosystem Needs

Mar 26, 2024 -

Don Dennison Appointed to Roll Out KIC's Latest Thermal Analysis System Software in the Northeast

Mar 26, 2024 -

Altus Group Achieves Record Sales Milestone with Koh Young Europe

Mar 26, 2024 -

STI Welcomes Edrick Young as the Newest Mechanical Assembly Technician

Mar 26, 2024 -

Anda Technologies Receives 2024 NPI Award for Setting a New Standard in Smart Manufacturing

Mar 26, 2024 -

ZESTRON's Olaf Schoenfeld, Ph.D. to Participate in EV Special Session at IPC APEX Expo

Mar 26, 2024 -

North American EMS Industry Up 4.1 Percent in February

Mar 26, 2024 -

SMTA Europe Announces 2024 Spring Conferences

See electronics manufacturing industry news »

AI Technology, Inc. (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF) news release has been viewed 1273 times

  • SMTnet
  • »
  • Industry News
  • »
  • AI Technology, Inc. (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF)
See Your 2024 IPC Certification Training Schedule for Eptac

Reflow Oven