Aug 27, 2014 
Indium Corporation's Karthik Vijay, technical manager for Europe, Africa, and the Middle East, will present at the SMART Group’s seminar, Reliability and Standards in Real Life: An IPC and SMART Group Perspective, on Sept. 11 in Swindon, U.K.
Vijay will present The Effect of Reflow Profiling on the Electrical Reliablity of No-Clean Solder Paste Flux Residues. This paperdiscusses the outcomes of a study that applied IPC J-STD-004 surface insulation resistance (SIR) testing to a halogen-free (ROL0) and a halogen-containing (ROL1) Pb-free, no-clean solder paste to determine and compare the effects of reflow profiling on electrical reliability.
Vijay is based in the U.K. and manages Indium Corporation’s technology programs and technical support throughout Europe. His expertise is focused on solder paste, engineered solders, thermal interface materials, and semiconductor-grade electronics assembly materials. Vijay is active in several industry organizations, including IMAPS and SMTA, and has presented at industry forums and conferences internationally. He earned his master’s degree in systems science and industrial engineering from Binghamton University, State University of New York.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA. For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.
