Aug 28, 2014 
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that Dr. Evstatin Krastev, Director of Applications, will present two papers at the upcoming SMTA International exhibition. One of the papers is a joint study with the Flextronics International team. Both presentations will be held during Session PRC1, “Radiography Techniques for Inspection of Advanced Electronic Packages,” and will take place Tuesday, Sept. 30, 2014 from 2-3:30 p.m. in Room 51 at the Donald Stephens Convention Center in Rosemont, IL.
John Tingay, Technical Director, X-ray Products at Nordson DAGE and Dr. Krastev co-authored the paper entitled, “X-ray / Bondtester Reliability Study of BGA Devices – Impact of Interfacial Voiding.” To date, there have been no quantitative studies trying to explain the impact of interfacial voiding on joint reliability and compare this to the impact of the voiding that is located within the bulk of the solder joint. In this study, the Large Board CT technique was used in conjunction with the well-established method of Bondtest Shear in an effort to correlate the bond strength as measured by the shear test to the size and location of the voiding as determined by the Large Board CT. In an effort to achieve good statistical significance, a very large sample of BGA devices mounted on PCBs is utilized. To speed up the process, various levels of automation for both the Bondtester and X-ray measurements are employed.
Flextronics and Nordson DAGE partnered to write the paper entitled, “Optimizing X-ray Inspection with Package on Package.” Dr. Krastev co-authored the paper with Zhen (Jane) Feng, Ph.D., David Geiger, Weifeng Liu, Ph.D., Hung Le, Tho Vu, Anwar Mohammed and Murad Kurwa, Flextronics International. Achieving the best possible PoP solder joint quality has become increasingly important consideration for the PCBA manufacturers. Most of the solder joints of a PoP device are invisible by optical means, thus X-ray inspection is the only way to examine POP solder quality in a non-destructive way. As a consequence it is becoming more frequently used at the SMT lines. It is very important for the PCBA manufacturers to be able to test PoP using Automated X-Ray Inspection (AXI) within the SMT line. The goals for this project were as follows: 1. Understand current AXI capabilities detecting PoP defects; 2. Explore ways to optimize the AXI algorithms in order to improve defect detection; 3. Try to develop a process for AXI algorithm optimization.
Headquartered in Aylesbury, UK, Nordson DAGE is a unit of the Nordson Corporation and manufactures and supports a complete range of award winning digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries. For more information, visit www.nordsondage.com.
Nordson Corporation engineers, manufactures and markets differentiated products and systems used for the precision dispensing and processing of adhesives, coatings, polymers and plastics, sealants, biomaterials and other materials and for fluid management, test and inspection, UV curing and plasma surface treatment, all supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 30 countries. Visit Nordson on the web at www.nordson.com, www.twitter.com/Nordson_Corp or www.facebook.com/nordson.
