Sep 30, 2015 ZESTRON, the globally leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that Umut Tosun, M.S.Ch.E., Application Technology Manager, ZESTRON Americas, will present “Impact of Multiple Thermal Cycles on the Cleaning Process” at SMTA International 2015.
Printed circuit board manufacturing is a highly complex process and incorporates numerous steps. The soldering process is critical and may include reflow oven and/or wave solder equipment as well as a baking process. PCBs may be single or double-sided in which case multiple thermal cycles are required. There are many opportunities to clean PCBs following a soldering process, either from single, dual or dual and baked thermal cycles. This study was conducted to assess the effects of numerous thermal cycles on the PCB cleaning process. Solder pastes considered included RMA, No Clean and Water Soluble (OA), both leaded and lead-free.
SMTA International 2015 will be held at the Donald Stephens Convention Center in Rosemont, IL from September 29 to September 30. Mr. Tosun will present during the “Cleaning Parameters and Cleanliness Monitoring of Electronics Assemblies” session on September 30, at 8:00 AM. For more information on our process solutions, services and learning opportunities, please visit booth #616.
Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry. With six worldwide Technical Centers and the largest team of chemical engineers in the industry, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.
For additional information and to tour one of our unparalleled technical centers, please visit www.zestron.com.
