SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Indium Corporation to Feature Low-Voiding Solder Paste at IPC APEX 2016

Indium Corporation to Feature Low-Voiding Solder Paste at IPC APEX 2016

Feb 06, 2016

Indium Corporation will feature its void-reducing no-clean solder pastes to help customers Avoid the Void™ at IPC APEX Expo, which will be held on March 15-17 in Las Vegas, Nev. 

Indium Corporation, the industry-leading source of void-reducing materials and results, has specifically formulated Indium10.1 solder paste to reduce voiding significantly below the industry average – for improved finished goods reliability. Indium10.1 delivers robust reflow capabilities and a wide processing window, which accommodates various board sizes and throughput requirements, and minimizes defects.

For a halogen-free option, Indium8.9HF solder paste delivers very low-voiding. Its unique oxidation barrier technology makes it perfectly suited for a variety of applications, especially automotive assembly.

In addition to outstanding print transfer and excellent response-to-pause, Indium10.1 and Indium8.9HF both provide excellent pin-in-paste solderability and hole-fill, while remaining stable at room temperature for up to 30 days.

Avoid the Void means manufacturers no longer have to settle for unacceptable levels of voiding when soldering QFNs, CSPs, or BGAs.

Indium10.1 and Indium8.9HF are part of Indium Corporation’s family of high-performance, lead-free, low-voiding, no-clean solder pastes. For more information about Indium Corporation’s low voiding solder paste, email askus@indium.com or visit www.indium.com/avoidthevoid.


Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA. For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

May 20, 2024 -

Indium Corporation Experts to Present on Power Electronics at PCIM Europe

May 20, 2024 -

Indium Corporation Experts to Present at Electronics in Harsh Environments SMTA Conference.

May 20, 2024 -

Indium Corporation Expert to Present on Alternative Solder Alloys to Solve Emerging Challenges at SMTA Rocky Mountain Expo & Tech Forum

May 20, 2024 -

Indium Corporation Experts to Present on High-Temperature, Lead-Free Solder Paste and High Reliability Liquid Metal Alloys Poster at ECTC

Feb 26, 2024 -

Indium Corporation Advisor to Present, Host Tutorial at TestConX 2024

Feb 19, 2024 -

Indium Corporation Expert to Present Technical Paper at IMAPS France

Feb 19, 2024 -

Indium Corporation Prepared to Deliver Three Presentations at APEC 2024

Feb 19, 2024 -

Indium Corporation to Kick Off Season Three of EV InSIDER Live Webcast Series with Charging Session

Jan 29, 2024 -

Indium Corporation Experts to Present at SMTA Pan Pac

Jan 29, 2024 -

Indium Corporation to Feature Precision Au-Based Die-Attach Preforms at SPIE Photonics West

411 more news from Indium Corporation »

Nov 18, 2024 -

IPC Celebrates National Apprenticeship Week with a Focus on Electronics Manufacturing Excellence

Nov 18, 2024 -

IPC Introduces First Standard for In-Mold Electronics

Nov 18, 2024 -

Disruptive Innovation and Generative AI Inventor, Kevin Surace, to Keynote IPC APEX EXPO 2025

Nov 18, 2024 -

Etek Europe Expands Partnership with ITW EAE to Represent Despatch Products in the UK and Ireland

Nov 18, 2024 -

Kurtz Ersa Honors Jean Verchere's 30 Years of Dedication as He Retires

Nov 18, 2024 -

KIC Launches Game-Changing TAS Software Platform to Address Emerging Thermal Process Challenges

Nov 18, 2024 -

Nordson Test & Inspection Receives Top Honor with Prime Step-by-Step Innovation Award for SQ3000M2 System

Nov 18, 2024 -

Scienscope's New Xspection 3120 Inspects Long PCBs

Nov 18, 2024 -

PARMI USA, INC. Appoints Juan Arango as Head of Sales and Business Development to Drive U.S. Market Growth

Nov 18, 2024 -

Naprotek Welcomes Aerospace and Defense Veteran to Board of Directors

See electronics manufacturing industry news »

Indium Corporation to Feature Low-Voiding Solder Paste at IPC APEX 2016 news release has been viewed 1040 times

  • SMTnet
  • »
  • Industry News
  • »
  • Indium Corporation to Feature Low-Voiding Solder Paste at IPC APEX 2016
Encapsulation Dispensing, Dam and Fill, Glob Top, CSOB

Reflow Oven