Feb 25, 2016 
FCT Assembly (www.fctassembly.com), well-known in the electronics assembly industry for its Fine Line Stencil and FCT Solder divisions, will highlight its broad portfolio of printing products at IPC APEX 2016 (www.ipcapexexpo.org), as well as take part in multiple technical conference programs. From booth # 1139 over March 15 - 17, the FCT exhibit will play host to the company’s various technologies including innovative step/relief stencil capabilities, NanoSlic Gold coated stencil and newly formulated, pre-released water soluble paste, WS890.
“At our foundation, we are chemistry formulation experts and this expertise drives the development of major industry breakthroughs, which show attendees are encouraged to discuss with our team,” says FCT President, Mike Scimeca.
NanoSlic has quickly emerged as the premiere coating technology for improved solder paste transfer efficiency, reduced underside cleaning requirements and overall printing yield improvements. On Wednesday, March 16th during the “Stencil Printing” technical session, FCT will be presenting a paper entitled “An Investigation into the Use of Nano Coated Stencils to Improve Solder Paste Printing with Small Stencil Aperture Area Ratios” which highlights the effect Nano Coatings have on transfer efficiency and print definition.
In addition to WS890, FCT will be showcasing their next generation of solder products including pastes, leading lead-free solder bar (SN100C), wires and fluxes. Tony Lentz, FCT Assembly Field Application Engineer, will present a paper entitled “Water Soluble Solder Paste, Wet Behind the Ears or Wave of the Future?” as part of the “Solder Paste Development” session set to take place on Tuesday, March 15th. The paper underscores the research and development of a new water soluble lead-free solder paste that improves on the performance characteristics of existing No-Clean technologies.
For more information or to schedule an appointment, send an e-mail to jglanzer@fctassembly.com.
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