SMT, PCB Electronics Industry News

SHENMAO Features Solder Preforms at IPC APEX 2016

Mar 11, 2016

SHENMAO Solder Preforms offer accurate solder deposition for various soldering processes. Reel packaged Solder Preforms provide opportunity for automation and efficient application to supplement solder when insufficient quantity solder paste is provided by design.

Custom Material may be formulated to unique material and dimensional requirements.

SHENMAO recently expediently solved an insufficient solder issue problem experienced by a major Electric Automobile Manufacturer that prevented a costly potential field repair.

As the Worlds Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Laser Soldering Paste, Wave Solder Bar, Solder Wire, Solder Preform, Package on Package Solder Paste, Bumping Solder Paste, Low Temperature Solder Paste, Semiconductor Packaging Solder Spheres, Liquid Flux, Paste Flux and PV Ribbon.

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SHENMAO America Introduces Advanced Low-Temperature Ball Attachment Process Solutions for Ultra-Thin Electronics Packages

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SHENMAO Introduces Rosin-Free No-Clean Liquid Flux SM-ZR10 for Automatic Wave Soldering Process

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SHENMAO Recycled Solder Materials PF606R-PW215 and PF629R-B Receive UL ECVP 2809 Certification

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SHENMAO Develops Thermal Fatigue-Resistant Solder Paste PF918-P250 for High-Reliability Requirements

May 13, 2024 -

SHENMAO's PF606-P276 Ultra-Low Void Paste Ensures High Joint Strength

Apr 29, 2024 -

SHENMAO Debuts Special Solder Paste for AI Substrate Power Management Modules

Mar 18, 2024 -

SHENMAO Low-Temperature Solder Paste PF735-PQ10-10 Is Designed for High-Speed Printing Processes

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SHENMAO to Showcase Advanced Automotive Electronic Solutions at 2024 IPC APEX EXPO

Feb 12, 2024 -

New Low Residue No-Clean Flip Chip Flux SMF-D61 from SHENMAO

Jan 15, 2024 -

SHENMAO Embarks on Expansion with a New Factory in Texas to Serve Automotive Applications

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