Apr 26, 2016 SHENMAO Technology, Inc. will present the technical paper “A New Dispensing Solder Paste for Laser Soldering Technology” at the 10 th. Anniversary of the SMTA International Conference of Soldering and Reliability 2016 in Toronto, Canada, featuring advancements in newly developed composition of Powder, Fluxes and produces best dispensability, minimal flux residue, no-splash or solder balling issues and minimal and smaller voids.
ABSTRACT:
Laser soldering method becomes attractive in the packaging and assembly of surface-mounted devices and microelectronics. The method transfers laser energy for reflow process with a non-contact procedure and determines the soldering location precisely. It is critical to consider formulated solder paste due to the amount of heat absorbed by flux and alloys when applying the method to reliable joints. A new solder paste of alloy composition of Sn-3.0Ag-0.5Cu in a dispensing way is developed for the automatic laser soldering processes. This paper presents the results of soldering SMD components on circuit boards with minimal flux residue and no splash or solder balling issues. Cross-sectional studies showed the reduction of intermetallic formation in well-formed solder joints. In addition, the joints have high shear strength due to lower thermal stress during the process. This new solder paste was proved to be suitable for repair of electronic components and manufacturing electronic parts that cannot be soldered in a conventional reflow oven.
SMTA International Conference of Soldering and Reliability
Date: May 9 -11, 2016 Click: http://www.smta.org/icsr/register_now.cfm
Venue: Hilton Toronto/Markham Suites Conference Centre,
8500 Warden Avenue, Markham, ON, L6G 1A5, Canada 1-905-470-8500
Presentation: Tuesday, May 10 – Technical Program / 4:15 PM to 4:45 PM
Topic: A New Dispensing Solder Paste for Laser Soldering Technology
Speaker: Watson Tseng, General Manager, SHENMAO America, Inc., San Jose, CA 95131
Co-Authors: Hsiang-Chuan Chen, Jen-Yio Shiu, Chang-Meng Wang, Roderick Chen, Watson Tseng
Speaker Biography
For the last 3 years, Watson Tseng is the General Manager of Shenmao America, Inc. He worked in the Shenmao Micro Material Institute for 6 years as a group leader in charge of solder paste development and set up and ran European Operations for 5 years. He has 14 years of experience in failure analysis of SMT and packaging applications. Watson received his M.S. in Chemical Engineering from National Taiwan University, Taiwan. E-mail: watson_tseng@shenmao.us
Now in its 43rd year, SHENMAO Technology Inc., founded by Mr. San Lian Lee, Chairman and CEO of the globally leading solder material provider, started by manufacturing resin flux cored solder wire and solder bar in 1973 at its Taiwan Headquarters, first for Taiwan and then for the Asian market, continuously expanding since 1998 to 10 worldwide locations.
SHENMAO is the leading solder material manufacturer in Asia since 1973. For more than 43 years, SHENMAO has been dedicated in solder products including water soluble and no clean solder paste, laser solder paste, cored solder wire, wave solder bar alloys, wave soldering fluxes, solder powder up to T8, BGA and Micro BGA solder sphere, LED die attach paste, high performance liquid fluxes, solder preform, and solar ribbon used in PCB assembly and semiconductor packaging processes. As an award-winning supplier of electronics assembly materials, we place quality at the heart of everything we do, and always provide excellent service to our customers. SHENMAO has established manufacturing sites all over the world to provide instant delivery and support. SHENMAO America, Inc. produces solder paste in its company owned facility in San Jose, CA, USA for the North American market.
SHENMAO MICRO MATERIAL INSTITUTE
In order to research and develop the next generation of Solder Material products, SHENMAO established the SHENMAO MICRO MATERIAL INSTITUTE (SMMI) in 2003. The main purpose of the institute is to study and focus on the development and improvement of Micro Lead Free Materials with the highest Quality and Performance. The 1,500 square meter (16,146 Sq. Ft.) SMMI is staffed with 36 engineers (3 PhDs, 8 Masters) continuously developing Innovative New Lead Free Solder Alloys, New Lead Free Solder Paste and Fluxes. SMMI’s mission is to improve on the ability of Product Development for a total solution through technological innovation. SMMI has been working closely with electronic manufacturers, universities, and research organizations in the field for innovated material, technology, and failure analysis.
SHENMAO America, Inc. www.shenmao.com/ Tel: 408-943-1755 e-mail: usa@shenmao.com
